In the news release, NewPhotonics Introduces NPG102
Transmitter-on-Chip for DSP-based Optical Modules Serving 1.6 Tbps
AI-era Data Center Interconnect, issued Sept. 19, 2024 by NewPhotonics Ltd over PR
Newswire, we are advised by the company that there are edits to the
release. The complete, corrected release follows:
NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based
Optical Modules Serving 1.6 Tbps AI-era Data Center Interconnect
Optical head transmitter with integrated lasers enables
all-optics transceiver innovation in network and compute
infrastructure
TEL
AVIV, Israel, Sept. 19,
2024 /PRNewswire/ -- NewPhotonics Ltd., a leader in
advanced integrated photonics technologies, today introduced its
NPG102 PIC transmitter on chip (TOC) at 1.6Tbps for DSP-based
optical transceiver modules to join the NPG102 TOC for LPO-based
modules announced in March supporting the LPO and LRO optical
transceiver market where no DSP is required.
The addition of the NPG102 TOC for DSP-based modules to our
suite of PIC solutions delivers the low latency data communications
at low power consumption and reduced channel loss core to the
NPG102 chip technology designed to meet the increasing AI-cluster
processing demands on data center infrastructure.
The optimized flip-chip integrates octal channel, auto-tunable
lasers and 224Gbps PAM4 modulation featuring aggregated bandwidth
at 1.6Tbps with electrical to optical transmission. Internal
ADC/DAC supports channel control and monitoring in a package with
on-chip temperature monitoring at low 2.9W power consumption.
Integrated Lasers Improve Module Time to
Market
Designed for pluggable OSFP modules, the monolithically
integrated lasers and modulators improve system integration with
wafer-level laser alignment and integrated direct modulation. This
additional advantage of all-optics innovation in the transceiver
chip design results in accelerated OEM manufacturing yield maturity
and time to market for transceiver module delivery.
"As data centers worldwide strive to accelerate infrastructure
improvements that enhance AI workload performance, the entire value
chain is seeking progressive solutions that deliver faster and more
energy efficient data processing." said Doron Tal, senior vice president and general
manager of Optical Connectivity. "The NPG102 TOC for 1.6Tbps
DSP-based modules joins our NPG102 chip for LPO on our all-optics
innovation roadmap of generational of solutions allowing us to
serve the needs of both DSP-based pluggable and LPO-based pluggable
optics segments and put data centers on a path in this decade to
deliver higher capacity, low power optical connectivity."
The NewPhotonics NPG102 PIC transmitter-on-chip for DSP-based
transceiver modules is available in our Easly Access Program with
market availability expected in the second quarter of 2025.
About NewPhotonics
NewPhotonics is a fabless semiconductor designs, develops and
manufactures photonic integrated circuit (PIC) solutions for AI-era
data center optical communications. Our integrated NPG102 PIC
transmitter on chip family delivers low latency, reduced power in
optical transceiver modules for all-optics connectivity. The
company's silicon photonics innovations breakthrough speed, energy
and distance barriers in optical I/O in a new all-optics paradigm.
NewPhotonics, based in Tel Aviv,
Israel, is privately held and funded. For more information
visit www.newphotonics.com
Press Contact:
Corporate Communications
press.relations@newphotonics.com
+972 3 614-3147
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SOURCE NewPhotonics Ltd