BindKey Selects FTD Solutions as Southeast Asia Distributor
November 09 2004 - 5:00AM
PR Newswire (US)
BindKey Selects FTD Solutions as Southeast Asia Distributor
Appointment Extends Global Services for Global IC Design Accounts
SUNNYVALE, Calif., Nov. 9 /PRNewswire/ -- BindKey Technologies, a
DuPont Photomasks (NASDAQ:DPMI) company and leading provider of
design for manufacturing (DFM) solutions for nanometer IC design,
today announced the appointment of FTD Solutions (
http://www.ftdsolutions.com/ ) as its exclusive distributor for
Singapore, Malaysia and India. FTD will distribute BindKey's
RapiDesignClean(TM) and RapiDRCFix(TM) DFM products. FTD Solutions
provides a full range of EDA sales and support functions,
customized training and consultancy. FTD Solutions is one of the
largest distributors of IC design solutions in the Asia Pacific
region, with sales offices in Singapore, Malaysia and India, where
they also have a joint venture with Toshiba for IC design. FTD
Solutions joins other leading BindKey distributors in Asia,
including Innotech in Japan, Davan Tech in Korea and Maojet in
Taiwan. "IC design is a global activity, with Singapore, Malaysia
and India rapidly increasing their share," said Jeff Menkes,
BindKey vice president of worldwide sales. "BindKey chose FTD
Solutions because it is a top-notch distribution company, and, as a
design organization, it understands the complex requirements of
nanometer design and the importance of moving DFM further up in the
design cycle." "As a leading EDA software distribution company for
the last 10 years in Southeast Asia and India, we have consistently
worked with companies like BindKey that understand the design
issues engineers face and provide practical automation solutions,"
said Effindi Ahmad, general manager of EDA distribution for FTD
Solutions. "With its very fast RapidDesignClean product and other
DFM products, BindKey enables correct-by-construction design even
with the complex design and manufacturing rule sets required in
nanometer design. The best part of the BindKey product line is it
works with a customer's current design environment without
requiring replacement of toolsets or changes in methodology."
BindKey DFM Solutions By solving manufacturability requirements
during the design process, BindKey is addressing some of the
toughest challenges in IC physical implementation. Chief among
these are increasing design complexity and manufacturing
constraints. With nanometer ICs, designers must assure that the
physical design (layout) can be manufactured with acceptable yield,
account for the manufacturing process impact on chip function and
performance, and manage critical tradeoffs between performance and
yield. BindKey is meeting these challenges with new solutions to
implement complex rules-driven requirements, verify
manufacturability and optimize layout for lithography, yield and
performance. BindKey's DFM solutions include: -- RapiDesignClean, a
rules-driven IC layout solution that enables engineers to produce
DRC-clean layouts fast and manage application of recommended DFM
rules. RapiDesignClean is the first tool of its kind to provide
full support for the most advanced technologies (90nm and below) in
real time. RapiDesignClean lets layout engineers see exactly which
rules apply for each edit, provides immediate notification when
rules are violated and automatically repairs many violations in
real time. The product complements customers' existing layout and
physical verification flows. -- RapiDRCFix is a rules-driven auto
layout correction tool for repairing design rule violations and
implementing recommended DFM rules for nanometer IC layout.
RapiDRCFix can correct thousands of DRC violations in less than an
hour and supports large-scale implementation of recommended DFM
rules. About BindKey BindKey is a leading supplier of semiconductor
design for manufacturing (DFM) software solutions. The company's
electronic design automation (EDA) tools produce
design-rule-correct integrated circuit (IC) layouts, improving
chipmakers' productivity and time to market by solving
manufacturing issues during the physical design phase. BindKey is
headquartered at 510 North Pastoria Ave., Sunnyvale, Calif., and
has direct sales and support offices in Silicon Valley, Austin,
Texas, Munich, Germany, and distributors throughout the Pacific
Rim. For more information, please call 866-RapidIC (866-727-4342)
or visit the company Web site at http://www.bindkey.com/. BindKey
is a wholly owned subsidiary of DuPont Photomasks, Inc. NOTE:
RapiDesignClean and RapiDRCFix are trademarks of BindKey
Technologies Inc. All other products are trademarks of their
respective companies. FORWARD-LOOKING STATEMENTS: Certain
statements contained in this document that are not historical
facts, are "forward looking statements," as that term is defined in
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934, that involve a number of risks and
uncertainties. Such forward-looking statements may concern growth
and future operating results, forecasts, projections, pricing
pressures, the global economic climate, new products and product
enhancements, the future importance of EDA technology, the demand
for products, competitive factors, research and development
activities and expenditures, strategic relationships with third
parties, and our strategy. Such forward-looking statements are
based upon management's current plans, expectations, estimates and
assumptions and are subject to a number of risks and uncertainties.
Actual events or results may differ materially from those described
in this press release due to a number of risks and uncertainties.
Additional risk factors affecting our business may include
relationships with and dependence on the semiconductor industry,
fluctuations in quarterly and annual earnings, operating in a
capital intensive industry, significant fixed costs, rapid
technological change, competition, significant international
operations, world-wide market volatility, manufacturing risks,
fluctuation of income tax rates, concentration of customers,
dependence on suppliers, dependence on management and technical
personnel, volatility of market prices, potential acquisitions or
dispositions, technology challenges in the manufacture of advanced
photomasks, intellectual property, and changes in governmental laws
and regulations. Factors that could cause or contribute to such
differences include, but are not limited to, those factors set
forth above, certain of which are more fully discussed under the
caption "Risk Factors" in the Company's Annual Report on Form 10-K
filed with the Securities and Exchange Commission dated September
9, 2004 and the Company's quarterly report on Form 10-Q dated
November 5, 2004. The forward-looking statements are made as of the
release date hereof and we disclaim any intention or obligation to
update or revise any forward-looking statements or to update the
reasons why the actual results could differ materially from those
projected in the forward-looking statements, whether as a result of
new information, future events or otherwise. DATASOURCE: BindKey
Technologies Inc. CONTACT: Rich Bruer of McClenahan Bruer,
+1-503-546-1000, or , for BindKey Technologies Inc.; or investors,
Tom Blake of BindKey Technologies Inc., +1-512-310-6562, or Web
site: http://www.ftdsolutions.com/ Web site:
http://www.bindkey.com/
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