Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers
June 24 2024 - 1:00PM
Business Wire
Daeduck Electronics announced the successful development of a
large body FCBGA substrate for AI servers and data centers.
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the full release here:
https://www.businesswire.com/news/home/20240624950912/en/
Large Body FCBGA developed by Daeduck
Electronics (Photo: Business Wire)
Established in 1965, Daeduck Electronics holds the distinction
of being Korea's pioneering mass-producer of PCBs (Printed Circuit
Boards), thus contributing significantly to the advancement of the
nation's electronics sector for over six decades. With operations
spanning five strategic locations, including four in Korea and one
in Vietnam, coupled with its presence in key international markets
through sales offices in the United States, China, and Taiwan, the
company is poised for dynamic growth in tandem with the global
package substrate market.
In recent years, Daeduck Electronics has strategically realigned
its focus towards Semiconductor Package Substrates, marking a
decisive entry into the FCBGA (Flip Chip Ball Grid Array) market
through comprehensive investments commencing in 2021. This
strategic movement has gained acclaim, positioning Daeduck
Electronics as Korea's premier FCBGA manufacturer, underscored by
tangible achievements and visible market impact.
FCBGA (Flip-chip Ball Grid Array) is a high-density
semiconductor substrate that connects semiconductor chips and
package substrates using the flip-chip method and improves
electrical and thermal characteristics. Daeduck Electronics knocked
the FCBGA market for AI servers and data centers, which was
previously dominated by global peer companies in Japan and
Taiwan.
Daeduck Electronics' large body FCBGA substrate is a
state-of-the-art substrate with a size of 100mm x 100mm, with 20 or
more layers, and is applied to high-performance computing (HPC)
chips, which are commonly known as data center chips. Daeduck
Electronics' large body FCBGA substrate can also be applied to
CPUs, GPUs, and 2.5D packages known as CoWoS (Chip on Wafer on
Substrate) packaging used in AI (artificial intelligence) servers.
In fact, it has acquired the technological capabilities to enter
all product markets that can be entered through FCBGA.
In addition, the company is preparing for another challenge in
the next-generation packaging market by developing a technology
that integrates silicon capacitor embedding technology, bridge
integration technology, and large body FCBGA substrate
technology.
"As semiconductor technology advances rapidly, we will focus on
expanding our market share in next-generation markets such as AI
and autonomous driving through collaboration with global major
companies based on our differentiated cutting-edge technology,"
said Young-Joo KO, CTO Daeduck Electronics.
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version on businesswire.com: https://www.businesswire.com/news/home/20240624950912/en/
Jay Nam – VP, Engineering (jay.nam@daeduck.com, +1
949-880-4378)
Daeduck Electronics Official SNS Website:
https://www.daeduck.com/eng/ LinkedIn:
https://www.linkedin.com/company/daeduck/ YouTube:
https://www.youtube.com/@daeduckelectronics