SYDNEY, Aug. 15, 2013 /PRNewswire/ -- Audio Pixels
Holdings Limited (ASX:AKP; OTCQX:ADPXY), a fabless semiconductor
company focused on the development and production of MEMS based
digital speaker chips revealed today that since the beginning of
the new year its intellectual property portfolio has expanded to
include 5 new patent families. The patents granted in various
patent jurisdictions around the world include 2 patent grants for
the Basic architecture and functional principles of its MEMS based
digital speaker; control of volume and tone in digital speakers;
Directivity patterns in direct digital speakers; and in the field
of Packaging of MEMS based digital speakers.
"We are excited to see our patents granted as they
acknowledge Audio Pixels as a true pioneer and innovator in digital
speaker technologies," said Yuval
Cohen, Co-Founder and CTO. Audio Pixels patent portfolio now
encompasses not only the principle architecture and functionality
of digital speakers, but also critical innovations that enable the
technology to be commercially exploited.
He added, "For example, the recent patent granted to
us for Dust Protection covers a very unique innovation in
MEMS packaging that provides the highest levels of protection for
the chip from the environment while still permitting the sound
waves generated inside the chip, to radiate to the environment with
near negligible attenuation." MEMS packaging is considered
by the industry at large to be far more challenging than the
packaging of traditional IC's due to the diversity of requirements
associated with providing the ability for the transducer (or
sensor) to be in touch with the environment, yet protected from
it.
Fred Bart Chairman of Audio
Pixels Holdings Limited added: "As true pioneers in the digital
speaker space, we have massive opportunities to safeguard a wide
variety of critical enabling technologies, with global patents,
further enhancing our leadership position in the
marketplace."
About Audio Pixels
Audio Pixels patented technological platform utilizes entirely
new techniques to generate sound waves directly from a digital
audio stream using low cost micro-electromechanical structures
(MEMS). This innovation overcomes many of the limitations found in
conventional loudspeaker subassemblies thus enabling the production
of speaker products that deliver superior sound and electrical
performance all in a semiconductor type package that is remarkably
compatible with existing and emerging OEM requirements and
ambitions for their consumer electronic device designs.
For further information please contact:
Danny Lewin - CEO Audio Pixels Limited
+972-732-324-444
danny@audiopixels.com
SOURCE Audio Pixels Holdings Limited
