Translucent Announces Commercial Availability of vGaN™ Wafer Templates for Low-Cost Epitaxial Growth of GaN Devices
August 08 2011 - 9:51AM
Business Wire
Translucent, Inc., a provider of rare-earth-oxide (REO)
engineered silicon substrates for low-cost, high-performance
epitaxial semiconductor applications, announced today the
commercial availability of its vGaN™ family of silicon-based wafer
templates. The vGaN products provide a low-cost, high-quality
epitaxial surface for the growth of gallium nitride (GaN) devices
such as light-emitting diodes (LEDs) or field-effect transistors
(FETs).
The vGaN product line is the world’s first commercial REO-based
family of ‘III-N semiconductors’ with scalable GaN-on-Si wafers.
Translucent’s use of crystalline REO layers provides stress relief
and wafer flatness through customized lattice engineering, leading
to a high quality growth surface. In addition, the wide bandgap of
the REO layer is expected to lead to much higher breakdown-voltage
characteristics for FETs grown on vGaN.
vGaN stands for “virtual gallium nitride.” It provides a
semiconductor growth surface that has the physical properties of
GaN, but utilizes a silicon substrate upon which is grown an
epilayer of REO material that accommodates a top epilayer of Group
III nitrides such as GaN. The vGaN substrate enables for the first
time, industry-standard MOCVD growth processes with the low cost
structures and economies of scale currently enjoyed by the silicon
industry.
Michael Lebby, Translucent’s general manager, noted, “We are
bringing a decade of Translucent REO epitaxial experience to bear
on the challenge of enabling GaN growth to scale cost-effectively
well beyond current limitations. Our vGaN platform is an
‘on-silicon’ technology, allowing us to harness mature
silicon-substrate technologies and their low costs, and we expect
this to have an extremely beneficial impact in driving down costs
for GaN-based LEDs and FETs.”
GaN is typically grown on sapphire substrates, which are
significantly more expensive at large diameters, especially 200 mm
and larger. Additionally, a major challenge facing device
manufacturers today is the handling of the large, heavy, and
expensive sapphire wafers. Such handling may require the purchase
of special handling equipment for the fabrication plants.
Conversely, the widely-used infrastructure of fabrication plants
that are ready to run silicon wafers up to 200 mm already exists.
This makes large-diameter silicon an ideal choice to bring
economies of scale into the lighting (LED) and power electronics
(FET) industries.
Translucent’s vGaN wafers are already available today at 100 mm
diameters, with 150 and 200 mm becoming available during the next
year.
About Translucent
Translucent, Inc., a subsidiary of Australian listed
company Silex Systems Limited. (SLX: ASX), is an advanced
materials company founded in 2001 that focuses on using rare-earth
oxides to provide low-cost, silicon-based templates for epitaxial
growth of semiconductors. With its emphasis on GaN- and
GaAs-compatible growth platforms, Translucent is developing
products for the solar, power FET, and solid-state lighting (LED)
industries. vGaN is a registered trademark of Translucent, Inc.
More information is available at www.translucentinc.com and
www.silex.com.au.
Forward Looking Statements and Business Risks:
Silex Systems is a research and development Company whose assets
are its proprietary rights in various technologies, including, but
not limited to, the SILEX technology, the Silex Solar technology
and business, Solar Systems technology and business, Translucent
technology and ChronoLogic technology. Several of the Company’s
technologies are in the development stage and have not been
commercially deployed, and therefore are high-risk. Accordingly,
the statements in this announcement regarding the future of the
Company’s technologies and commercial prospects are forward looking
and actual results could be materially different from those
expressed or implied by such forward looking statements as a result
of various risk factors. Some risk factors that could affect future
results and commercial prospects include, but are not limited to:
results from the SILEX uranium enrichment development program and
the stable isotopes program; the demand for enriched materials
including uranium, silicon, oxygen, carbon and others; the business
risks associated with SilexSolar’s manufacturing and marketing
activities; the risks associated with the development of Solar
Systems technology and related marketing activities; the outcomes
of the Company’s interests in the development of various
semiconductor, photonics and alternative energy technologies; the
time taken to develop various technologies; the development of
competing technologies; the potential for third party claims
against the Company’s ownership of Intellectual Property associated
with its numerous technologies; the potential impact of government
regulations or policies; and the outcomes of various
commercialization strategies undertaken by the Company.
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