BE Semiconductor to Present at CA Cheuvreux's European Mid Cap Conference
November 08 2006 - 2:30AM
PR Newswire (US)
DUIVEN, Netherlands, Nov. 8 /PRNewswire-FirstCall/ -- BE
Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq:
BESI; Euronext: BESI), a leading manufacturer of assembly equipment
for the semiconductor industry, today announced that the Company is
scheduled to present at CA Cheuvreux's European Mid Cap Conference.
Richard Blickman, President and CEO, will present at the
conference. The presentation will not be webcast. Place: Mandarin
Oriental Hotel, New York Time: 8:30 a.m. ET, Thursday, November 16,
2006 About BE Semiconductor Industries N.V. BE Semiconductor
Industries N.V. designs, develops, manufactures, markets and
services die sorting, flip chip and multi-chip die bonding,
packaging and plating equipment for the semiconductor industry's
assembly operations. Its customers consist primarily of leading
U.S., European, Asian, Korean and Japanese semiconductor
manufacturers and subcontractors which utilize its products for
both array connect and conventional leadframe manufacturing
processes. Contacts: Richard W. Blickman Cor te Hennepe President
& CEO Director of Finance Tel. (31) 26 319-4500 Tel. (31) 26
319-4500 David Pasquale The Ruth Group Tel. (1) 646 536-7006
DATASOURCE: BE Semiconductor Industries N.V. CONTACT: Richard W.
Blickman, President & CEO, or Cor te Hennepe, Director of
Finance, both for BE Semiconductor Industries N.V.,
+31-26-319-4500, ; or David Pasquale of The Ruth Group,
+1-646-536-7006, Web site: http://www.besi.nl/
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