Soitec: Soitec and Resonac announce the signing of a joint development agreement in SmartSiC™ to accelerate high-performance silicon carbide adoption in next-generation electric vehicles
September 24 2024 - 2:00AM
UK Regulatory
Soitec: Soitec and Resonac announce the signing of a joint
development agreement in SmartSiC™ to accelerate high-performance
silicon carbide adoption in next-generation electric vehicles
Soitec and Resonac announce the signing of a
joint development agreement in SmartSiC™ to accelerate
high-performance silicon carbide adoption in next-generation
electric vehicles
Tokyo (Japan) and Bernin (France), September
24th, 2024 — Resonac Corporation (formerly Showa
Denko K.K.) and Soitec (Euronext Paris - Tech Leaders), a leader in
the design and manufacture of innovative semiconductor materials,
have signed an agreement to develop 200mm (8-inch) SmartSiC™
silicon carbide (SiC) wafers using Resonac substrates and epitaxy
processes, in a major step for the deployment of Soitec’s
high-yielding silicon carbide technology in Japan and other
international markets.
SmartSiC™ silicon carbide is a disruptive
compound semiconductor material providing superior performance and
efficiency over silicon in high-growth power applications for
electric mobility and industrial processes. It allows for more
efficient power conversion, lighter and more compact designs and
overall system cost savings – all key factors for success in
automotive and industrial systems.
Christophe Maleville, Chief Technology Officer
at Soitec, commented: “Silicon carbide is being adopted for EV
and industrial applications, where it brings a significant system
cost advantage. To further accelerate this adoption, silicon
carbide yield and productivity must be improved. Associating
Resonac premium quality SiC materials with Soitec’s unique 200mm
(8-inch) SmartSiC™ technology will support volume availability of
record quality epi-ready substrate. The combination of our
respective technologies and products will optimize these substrates
using Resonac’s high-quality epitaxy. Soitec is proud and excited
to be partnering with Resonac to develop a best-in-class combined
SiC product offering for Japan and the world.”
Makoto Takeda, General Manager of Device
Solutions Business Unit at Resonac, commented: “We are delighted
to announce this partnership with Soitec, which is fully aligned
with our broader commitment to sustainable and energy-efficient
semiconductor solutions. By combining Resonac’s high quality
monocrystalline silicon carbide wafers with Soitec’s unique
SmartSiC™ technology, we will deliver improved production
efficiency of 200mm (8-inch) silicon carbide wafers and diversify
the epi-wafer supply chain.”
Soitec’s SmartSiC™ silicon carbide wafers, or
engineered substrates, are produced using the company’s proprietary
SmartCut™ technology to bond an ultra-fine layer of high-quality
mono-SiC ‘donor’ wafer to a low-resistivity polycrystalline
(poly-SiC) ‘handle’ wafer. The resulting engineered substrate
delivers significantly improved device performance and
manufacturing yields. By allowing multiple re-uses of the prime
quality mono-SiC wafer, the process also reduces overall energy
consumption during wafer manufacturing.
Soitec has a new fabrication plant at its
headquarters in Bernin, France, primarily dedicated to the
production of SmartSiC™ wafers for electric vehicles, renewable
energy and industrial equipment component applications.
About Soitec
Soitec (Euronext - Tech Leaders), a world leader
in innovative semiconductor materials, has been developing
cutting-edge products delivering both technological performance and
energy efficiency for over 30 years. From its global headquarters
in France, Soitec is expanding internationally with its unique
solutions, and generated sales of 1 billion Euros in fiscal year
2023-2024. Soitec occupies a key position in the semiconductor
value chain, serving three main strategic markets: Mobile
Communications, Automotive and Industrial, and Edge and Cloud AI.
The company relies on the talent and diversity of its 2,300
employees, representing 50 different nationalities, working at its
sites in Europe, the United States and Asia. Soitec has registered
over 4,000 patents.
Soitec, SmartSiC™ and Smart Cut™ are registered
trademarks of Soitec.
For more information: https://www.soitec.com/en/
and follow us on X: @Soitec_Official
Contact for more information:
media@soitec.com
About the Resonac Group
The Resonac Group is a new company established
as a result of the integration of the Showa Denko Group and the
Showa Denko Materials Group (former Hitachi Chemical Group) in
January 2023. The Group’s annual sales of semiconductor and
electronic materials amount to about 340 billion yen. The
Group especially has global top share of semiconductor materials
for packaging process. The integration of the two companies
has enabled the Resonac Group to design functions of materials as
well as to develop them in-house, going all the way back to raw
materials. The new trade name “RESONAC” was created as a
combination of two English words, namely, the word of “RESONATE”
and “C” as the first letter of CHEMISTRY. The Resonac Group
will make the most of its co-creative platform, and accelerate
technological innovation with semiconductor manufacturers, material
manufacturers, and equipment manufacturers inside and outside
Japan.
For detail, please refer to the Website of
Resonac Holdings Corporation: https://www.resonac.com/
- 20240923_PR Soitec-Resonac ENG
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