Ansys to demonstrate 3D multiphysics visualization of
electromagnetic and thermal effects in semiconductor packages at
Design Automation Conference
/ Key Highlights
- Existing Ansys capabilities with NVIDIA Omniverse platform
supercharge 3D integrated circuit (3D-IC) design by enabling
designers to optimize semiconductor chips within the context of a
system-on-a-chip
- By transforming data into meaningful visual insights, the Ansys
multiphysics platform empowers IC designers to interact with models
of electromagnetic fields and thermal effects for faster
diagnostics and optimization
PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ:
ANSS) today announced that it is adopting NVIDIA
Omniverse application programming interfaces (APIs) to offer
3D-IC designers valuable insights from Ansys' physics solver
results through real-time visualization. Ansys is ushering in the
next generation of semiconductor system design to improve outcomes
in applications including 5G/6G, Internet of Things (IoT),
artificial intelligence (AI)/machine learning (ML), cloud
computing, and autonomous vehicles.
3D-ICs, or multi-die chips, are vertically stacked assemblies of
semiconductor chips. A 3D-IC's compact form factor offers
significant performance gains without increasing power consumption.
However, denser 3D-ICs complicate design challenges related to
electromagnetic issues and the management of heat and stress. It
also makes tracing the origins of these problems more difficult. To
understand the interactions between 3D-IC components for more
advanced applications, 3D multiphysics visualization becomes a
requirement for effective design and diagnostics.
Ansys' integration of NVIDIA Omniverse, a platform of APIs for
developing OpenUSD- and NVIDIA RTX-enabled 3D applications and
workflows, will deliver the real-time 3D-IC visualization of
results from Ansys solvers, including Ansys HFSS™ Ansys Icepak™,
and Ansys RedHawk-SC™. This will help designers interact with 3D
models to evaluate critical phenomena like electromagnetic fields
and temperature variations. This interactive solution allows
designers to optimize next-generation chips to deliver faster data
rates, increased functionality, and improved reliability.
"Advanced manufacturing relies on marrying the physical world
with the digital," said Prith
Banerjee, chief technology officer at Ansys. "At Ansys, we
are harnessing the power of the NVIDIA Omniverse platform to
comprehensively simulate and design everything — from tiny
semiconductors to the expansive factories where they are produced.
Ansys tools, such as RedHawk-SC, already offer visualization
features, which are integrated with Omniverse to unlock a new realm
of potential."
In addition to integrating Omniverse, RedHawk-SC is now
accelerated by NVIDIA Grace CPU Superchips, helping it deliver
more performant multiphysics designs.
"Accelerated computing, AI physics, and physically based
visualization will drive the next era of industrial
digitalization," said Rev Lebaredian, vice president of
Omniverse and simulation technology at NVIDIA. "Ansys semiconductor
solutions connected to Omniverse Cloud APIs will help accelerate
the electronics ecosystem's design and engineering processes."
To see the demonstration of 3D-IC multiphysics visualization
with NVIDIA Omniverse, visit Ansys at DAC June
23-27th in San
Francisco at booth #1308.
/ About Ansys
Our Mission: Powering Innovation that Drives Human
Advancement™
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
|
|
Investors
|
Kelsey DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
View original content to download
multimedia:https://www.prnewswire.com/news-releases/ansys-enables-3d-multiphysics-visualization-of-next-generation-3d-ic-designs-with-nvidia-omniverse-302175984.html
SOURCE Ansys