Ansoft Releases ePhysics v2; New Release Provides Dynamic-Link Co-Simulation of Thermal and Stress Analysis With HFSS and Maxwe
August 02 2006 - 4:15PM
Business Wire
Ansoft Corporation (NASDAQ:ANST) today announced the immediate
availability of ePhysics(TM) v2. This latest version enhances
ePhysics' 3D steady-state thermal, transient thermal and linear
stress analyses coupling to HFSS(TM) and Maxwell(R) 3D with
dynamic-link co-simulation. The new capability allows engineers to
simulate heating, stress and deformation consequences of high- and
low-frequency electromagnetic fields. ePhysics v2 responds to the
market demand to have an integrated, multi-disciplinary approach to
electrical component design, essential for devices operating under
high power, faster data rates and reduced physical size, where
thermal and mechanical effects need to be evaluated due to their
influence on the overall performance. The ePhysics user interface,
including design management front-end, 3D modeler, parametric
control, simulation set-up and post-processing interfaces, have
been migrated to the Ansoft desktop concept shared by HFSS and
Maxwell 3D. Engineers can easily account for the thermal and
mechanical quantities that significantly contribute to a design's
overall performance directly within the familiar, easy-to-use,
Ansoft environment. Coupling ePhysics with Maxwell 3D provides the
cross-disciplinary analysis required in the design of
electromechanical devices. Typical applications include the
analysis of electric machines, power-generation systems,
transformers, microelectromechanical systems (MEMS) and solenoids.
"Now that ePhysics v2 can be coupled directly to Maxwell, we are
able to assess the thermal and stress behavior of magnetic
components very conveniently," said Richard Osman, PE, principal
product engineer, Siemens Energy & Automation Inc. "This
advanced capability from Ansoft has greatly improved our ability to
validate and optimize our designs before building hardware." HFSS
with ePhysics is vital for applications such as high-speed
packages, antennas, monolithic microwave integrated circuits
(MMICs), high-power microwave devices, military and broadcast
communications and biological heating with radio frequency (RF)
sources. These analyses include high-power, temperature-induced
stress and size changes of design components. New features include:
-- New Ansoft desktop interface -- Dynamic-link coupling with
Maxwell 3D and HFSS, which includes automatic mapping of power loss
and force densities integrated with adaptive meshing technology --
Multiple design couplings that may be "daisy chained" in the
process of creating complex applications -- Maxwell Transient -
Thermal Transient -- HFSS Transient Sequence - Thermal Transient --
Nonlinear thermal properties (conductivity vs. Temp) -- Anisotropic
stress solution -- 64-bit solvers available ePhysics is available
immediately for PC and UNIX(R) platforms. To learn more, visit
www.ansoft.com/ephysics. Editors: To download three high-resolution
ePhysics images and captions, please go to
ftp://ftp.ansoft.com/techsup/download/web/primg/ephysics_v2.zip.
About Ansoft Ansoft is a leading developer of high-performance
electronic design automation (EDA) software. Engineers use Ansoft
software to design state-of-the-art electronic products, such as
cellular phones, Internet-access devices, broadband networking
components and systems, integrated circuits (ICs), printed circuit
boards (PCBs), automotive electronic systems and power electronics.
Ansoft markets its products worldwide through its own direct sales
force and has comprehensive customer-support and training offices
throughout North America, Asia and Europe. For more information,
please visit www.ansoft.com.
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