Ansoft Releases TPA v5
January 17 2007 - 4:02PM
Business Wire
Ansoft Corporation (NASDAQ:ANST) announces Turbo Package Analyzer�
(TPA) v5. This latest version of TPA introduces new automation,
design flow and simulation capability needed for the extraction of
the electrical characteristics of complex high-performance
ball-grid array (BGA) style packaging, including wirebond (WBBGA),
flip-chip (FCBGA), chip-scale packages (CSPs) and System in
Packages (SiP). TPA v5 increases the capacity of the solver to
address larger-sized packaging problems and introduces greater
automation for generating and/or modifying 3D package layouts. TPA
v5 introduces a new user interface that includes new 2D editing and
3D viewing capabilities, unlimited undo/redo capability, powerful
new editing and automation features, such as geometry validation
checking and support for VB scripting. Combined with AnsoftLinks�,
a tool for simplifying data import and export between EDA and CAD
packages, TPA v5 generates resistance, inductance and capacitance
(RLC) models directly from popular package design tools. It accepts
CAD data and fully characterizes the entire package in three
dimensions. Extracted sub-circuits can be exported into Nexxim�,
the company�s high-performance circuit simulation software, or
existing SPICE tools (SPICE/IBIS format) for subsequent transient
analyses, such as crosstalk, overshoot and TDR. TPA v5 highlights
include: -- AC RLC computation for 3D structures -- Automated
coupled full-package AC RLC extraction using efficient surface
triangulation algorithms -- DC resistance computation for 3D
structures -- Automated net-by-net full-package DC resistance
extraction using a volumetric (tetrahedral) mesh -- Ability to
designate source and sink terminal assignment on any given net --
New 2D layout editor and 3D viewer -- Create advanced wirebond or
flip-chip designs from scratch or modify/correct designs imported
from third-party layout tools -- System-in-Package (SiP) design
with multiple wire bond configurations including Trace-to-trace,
Die-to-die and Cascaded -- User-defined wirebond profiles expanding
shapes from JEDEC 4- and 5-point to include arbitrary polylines --
Complex solderball models capture true shape and subsequent
electrical performance of solderballs and flip-chip solder-bumps --
New layer stack-up editor -- New via pad stack editor -- VB
scripting support -- Validation check to verify setup, including
detection of self-intersecting polygons; disjoint nets; overlapping
(DC-shorted) nets, vias and bond wires; illegal connections between
bonding pads and bond wires -- Microsoft Windows(R) XP Professional
x64 support Pricing and Availability: TPA v5 is available for
Microsoft Windows XP Professional, Windows XP x64 Edition and
Windows Server 2003. Contact your nearest Ansoft sales office for
pricing information. To download a high-resolution TPA v5 image,
please go to
ftp://ftp.ansoft.com/techsup/download/web/primg/tpa_50.tif. About
Ansoft Ansoft is a leading developer of high-performance electronic
design automation (EDA) software. Engineers use Ansoft software to
design state-of-the-art electronic products, such as cellular
phones, Internet-access devices, broadband networking components
and systems, integrated circuits (ICs), printed circuit boards
(PCBs), automotive electronic systems and power electronics. Ansoft
markets its products worldwide through its own direct sales force
and has comprehensive customer-support and training offices
throughout North America, Asia and Europe. For more information,
please visit www.ansoft.com.
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