ASAT Holdings to Present at Bank of America Credit Conference December 4, 2007
November 26 2007 - 10:00AM
PR Newswire (US)
HONG KONG and MILPITAS, Calif., Nov. 26 /PRNewswire-FirstCall/ --
ASAT Holdings Limited (NASDAQ:ASTT) (the "Company" or "ASAT"), a
global provider of semiconductor package design, assembly and test
services, today announced ASAT management will participate in the
Bank of America 2007 Credit Conference in Orlando, Fla., on
Tuesday, December 4, 2007 at 7:30 a.m. ET. (Logo:
http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO) Event: Bank
of America 2007 Credit Conference Date: Tuesday, December 4, 2007
Presentation Time: 7:30 a.m. ET Location: Royal Pacific Resort --
Orlando Webcast: http://www.asat.com/ About ASAT Holdings Limited
ASAT Holdings Limited is a global provider of semiconductor package
design, assembly and test services. With 18 years of experience,
the Company offers a definitive selection of semiconductor packages
and world-class manufacturing lines. ASAT's advanced package
portfolio includes standard and high thermal performance ball grid
arrays, leadless plastic chip carriers, thin array plastic
packages, system-in-package and flip chip. ASAT was the first
company to develop moisture sensitive level one capability on
standard leaded products. Today the Company has operations in the
United States, Asia and Europe. For more information, visit
http://www.asat.com/.
http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO
http://photoarchive.ap.org/ DATASOURCE: ASAT Holdings Limited
CONTACT: Jim Fanucchi of Summit IR Group Inc., +1-408-404-5400, ,
for ASAT Holdings Limited Web site: http://www.asat.com/
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