Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure
September 23 2024 - 9:00AM
Broadcom Inc. (NASDAQ: AVGO) today announced the general
availability of Sian™2, 200 Gbps per lane (200G/lane) PAM-4 DSP
PHY. Sian2 features 200G/lane electrical and optical interfaces to
augment the Sian DSP that supports 100 Gbps electrical and 200Gbps
optical interfaces. Sian and Sian2 DSPs enable pluggable modules
with 200G/lane interfaces that are foundational to connect next
generation AI clusters.
AI cluster sizes and cluster performance needs are
growing dramatically to support exploding AI model sizes. High
performance, low latency, and resilient connectivity are vital for
the scale-up and scale-out of next generation AI clusters. For
these networks, customers demand reliable optical network
connectivity with higher bandwidth, lower power, lower latency and
lower cost. This necessitates the migration from the 400G/800G
links with 100G/lane optics being used in AI clusters today to
800G/1.6T links with 200G/lane optics that Sian2 enables.
Broadcom’s Sian2 and Sian DSPs are optimized for 800G and 1.6T
optical module platforms and deliver unmatched performance by
doubling the bandwidth with lower power, lower latency and lower
cost per bit to facilitate AI data center scale.
“200G/lane DSP is foundational to high-speed
optical links for next generation scale-up and scale-out networks
in the AI infrastructure,” said Vijay Janapaty, vice president and
general manager of the Physical Layer Products Division at
Broadcom. “The Sian family of products reinforces Broadcom’s
leadership in optical DSP PHYs and enables our AI data center
customers to deploy high-performance 800G and 1.6T links.”
Further, the combination of Sian2 and Sian PHY and
Broadcom’s leading-edge 200G/lane optics, including
electro-absorption modulated laser (EML) and continuous wave laser
(CWL), provides the best-in-class performance and power consumption
enabling data center operators to cost-effectively scale AI
workloads.
“AI market leaders will start ramping optical
modules using 200G/lane in 2025,” commented Dr. Vlad Kozlov, CEO
and Chief Analyst at LightCounting. “There is a race for dominance
in AI fueling a demand for delivery in excess of 1M units of 1.6T
optical transceivers within the first 12 months. We have never seen
new products ramping at such rate.”
Sian2 Product Highlights:
- Low power 5nm 200G/lane DSP solution
enabling sub-28W 1.6T transceivers
- Supports 800G and 1.6T pluggable modules
- Support for both 212.5-Gb/s and 226.875-Gb/s data rates for
InfiniBand and Ethernet applications
- Support for multiple FEC options including Bypass, Segmented
and Concatenated FEC
- Built-in low-swing and high-swing laser driver for both SiP and
EML based optical modules
- Sub-80ns roundtrip (Ingress + Egress) latency for AI/ML
applications
- Crossbar support for ease of transceiver design
Demo Showcase at ECOC 2024Broadcom
Sian2 PHY and 200G/lane optics inside 1.6T DR8 optical modules will
be demonstrated in the Innolight Booth B81 and Eoptolink Booth D60
taking place at ECOC Exhibition 2024, in Frankfurt, Germany from
September 23-25. Attendees will see live transmit eye performance
and end-to-end pre-FEC & post-FEC performance with IEEE
compliant KP4 FEC.
“Sian2 enables the design of high-speed optical
transceivers for next generation switches, network interface cards
and accelerators with 200G SerDes interfaces,” said Richard
Huang, CEO, Eoptolink Technology. “The Broadcom Sian2 DSP and
Eoptolink’s innovative transceiver design approach results in
performance leading 1.6T pluggable optical transceivers. Combined
with Eoptolink’s high volume manufacturing capability, this ensures
the supply for the growing bandwidth in AI networks.”
“InnoLight is leading the industry’s transition to
1.6T with the lowest power transceiver solutions, leveraging
Broadcom’s Sian2 DSP,” said Hai Ding, VP of Marketing, InnoLight
Technology. “As engineering pioneers, we're redefining optical
networking with our cutting-edge innovations, and helping
accelerate the deployments of 200G/lane pluggables for next
generation AI workloads.”
AvailabilityBroadcom is currently
sampling the Sian2 BCM8582X device to its early access customers
and partners. Please contact your local Broadcom sales
representative for samples and pricing.
For more information on Broadcom’s 200G/lane
optical solutions, please click here.
About BroadcomBroadcom Inc.
(NASDAQ: AVGO) is a global technology leader that designs,
develops, and supplies a broad range of semiconductor, enterprise
software and security solutions. Broadcom's category-leading
product portfolio serves critical markets including cloud, data
center, networking, broadband, wireless, storage, industrial, and
enterprise software. Our solutions include service provider and
enterprise networking and storage, mobile device and broadband
connectivity, mainframe, cybersecurity, and private and hybrid
cloud infrastructure. Broadcom is a Delaware corporation
headquartered in Palo Alto, CA. For more information, go to
www.broadcom.com.
Broadcom, the pulse logo, and Connecting everything
are among the trademarks of Broadcom. The term "Broadcom" refers to
Broadcom Inc., and/or its subsidiaries. Other trademarks are the
property of their respective owners.
Press Contact: Khanh LamCorporate
Communicationspress.relations@broadcom.comTelephone: +1 408 433
8649
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