- Ceva-Waves™ Links™ IP Family delivers fully integrated
multi-protocol connectivity solutions with Wi-Fi, Bluetooth, UWB,
Thread, Zigbee, and Matter, simplifying development and
accelerating time to market for next generation, connectivity-rich,
MCUs and SoCs
- Ceva-Waves™ Links100, an IoT-focused connectivity platform
IP with RF implemented on TSMC 22nm, currently being deployed by a
leading OEM customer
NUREMBERG, Germany, April 8,
2024 /PRNewswire/ -- Embedded World -- Ceva,
Inc. (NASDAQ: CEVA), the leading licensor of silicon and software
IP that enables Smart Edge devices to connect, sense and infer data
more reliably and efficiently, today launched Ceva-Waves™ Links™, a
new family of multi-protocol wireless platform IPs. The integrated
offering supports the latest wireless standards to address the
surging demand for connectivity-rich chips targeting Smart Edge
devices in the consumer IoT, Industrial, automotive, and personal
computing markets. These industry-leading IPs include Wi-Fi,
Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread /
Zigbee / Matter), to offer a range of qualified, easy-to-integrate,
multi-protocol wireless communications subsystems, each featuring
optimized co-existence schemes and adapted to various radios and
configurations.
The Links™ family leverages the newly rebranded Ceva-Waves
portfolio of wireless connectivity IPs, formerly known as
RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi
6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT
applications is the first IP available in this family and is
currently being deployed by a leading OEM customer.
The demand for smaller, low-cost, high-performing, innovative
devices with versatile connectivity is driving the need to
consolidate multiple connectivity protocols in a single chip. ABI
Research reflects on the move from module-level integration to
on-die chip integration and forecasts that Wi-Fi plus Bluetooth
combo chipset shipments will approach 1.6 billion chips annually by
2028.
"Increasingly, wireless connectivity chips are required to
handle multiple standards to meet the evolving needs and diverse
use cases of consumer and industrial devices. The Ceva-Waves Links
family offers a significant value proposition to semiconductor
companies and OEMs, lowering the risk and investment required to
integrate multi-protocol wireless connectivity into chip designs.
Moreover with support for UWB, the Links family offers innovative
micro-location and radar sensing features for truly advanced smart
edge devices," said Andrew Zignani,
Senior Research Director, ABI Research.
"The Ceva-Waves Links wireless connectivity IPs build on our
extensive portfolio that already powers more than 1 billion devices
annually and has enabled us to establish a strong and diversified
customer base across consumer and industrial IoT applications,"
said Tal Shalev, Vice President and
General Manager of the Wireless IoT BU at CEVA. "With many
customers designing chips employing multiple wireless standards,
Links is a natural extension, leveraging our technology and
expertise to dramatically reduce the technology barrier but yet
delivering a tailored, optimal solution that provides the
high-performance, low latency and low-power connectivity
required."
Ceva-Waves Links Key Features
The first member of the
Ceva-Waves Links family, the Links100, is an integrated, low power,
Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT
applications, with the following key features:
- Wi-Fi 6 optimized for cost-sensitive IoT applications,
- Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio
with Auracast, and with a comprehensive suite of Bluetooth
profiles
- IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home
applications
- Optimized co-existence scheme for efficient concurrent
communications
- Pre-integrated with a low power multi-protocol radio at TSMC
22nm process
With its modular architecture, the Ceva-Waves Links family is
highly versatile to meet customers' needs, leveraging the latest
Ceva-Waves wireless IPs. Upcoming Links platforms may include:
- Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases,
from power-efficient IoT to high-speed data streaming
- Next generation Bluetooth for Channel Sounding and High Data
Throughout
- UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for
innovative micro-location and sensing features
- Optimized co-existence schemes for each specific
configuration
- Pre-integrated radio solutions, including partner and
customer's own technology, to address a wide range of
configurations and foundry process nodes
For more information, visit
https://www.ceva-ip.com/product/ceva-waves-links/
About Ceva, Inc.
At Ceva, we are passionate about
bringing new levels of innovation to the smart edge. Our wireless
communications, sensing and Edge AI technologies are at the heart
of some of today's most advanced smart edge products. From
Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust
communications, to scalable Edge AI NPU
IPs, sensor fusion processors and embedded application
software that make devices smarter, we have the broadest portfolio
of IP to connect, sense and infer data more reliably and
efficiently. We deliver differentiated solutions that combine
outstanding performance at ultra-low power within a very small
silicon footprint. Our goal is simple – to deliver the silicon and
software IP to enable a smarter, safer, and more interconnected
world. This philosophy is in practice today, with Ceva powering
more than 17 billion of the world's most innovative smart edge
products from AI-infused smartwatches, IoT devices and wearables to
autonomous vehicles and 5G mobile networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.