Cascade Microtech and imec Successfully Probe 25 µm-Diameter Micro-Bumps
July 31 2013 - 12:15PM
Marketwired
Cascade Microtech, Inc. (NASDAQ: CSCD), a leader at enabling
precision measurements of integrated circuits at the wafer level,
and imec, a world-leading nanoelectronics research center, today
announced breakthroughs in probing stacked integrated circuits
(3D-SICs), fueling an important growth engine for the semiconductor
market. Through a Joint Development Agreement, Cascade Microtech
partnered with imec to successfully probe 25 µm-diameter
micro-bumps on a wide I/O test wafer with its fully-automated CM300
probe solution utilizing an advanced version of Pyramid Probe®
technology. This achievement comes as part of imec's 3D integration
research program which includes other industry partners from the
entire semiconductor value chain.
The 3D semiconductor market (including 3D-SIC, 2.5D interposer,
and 3D WLCSP) is expected to represent 9% of the total
semiconductor value by 2017, according to Yole Développement. Logic
3D SoC/SiP (including interposer chips, APE, CPU, FPGA, wide I/O
memory, etc.) will be the biggest industry using 3D platforms in
the next few years. 3D applications will emerge in high-performance
computing, and electronic markets such as nanotechnology and
medical applications, which will benefit from the high-density
integration that 3D technology offers.
The semiconductor industry is exploring new methods to increase
the functionality of ICs at a smaller footprint, extending Moore's
Law. 3D-SICs offer a solution to the speed, power and density
requirements demanded by future mobile electronics platforms.
Through-Silicon Vias (TSV) used in 3D-SICs shorten interconnects
between logic elements, thus reducing power while increasing
performance. Within imec's 3D integration research program,
industry leaders are jointly developing design, manufacturing, and
test solutions to bring this new technology to high-volume
manufacturing.
Cascade Microtech's CM300 flexible on-wafer measurement system
was designed to deliver superior positioning accuracy and
repeatable contact, offering a level of precision that supports
both shrinking pad sizes and pitch roadmaps. The CM300 captures the
true electrical performance of devices with high-performance
capabilities that include low leakage and low noise. As a
comprehensive probing solution employing the latest advances in
Pyramid Probe technology, the CM300 has proven to meet the
fine-pitch (40 µm area array), low-force ( < 1gf/tip) advanced
probing requirements of 3D-SICs.
"We are excited that our work with Cascade Microtech has
resulted in such a breakthrough. I believe together we've achieved
a first in the industry," said Erik Jan Marinissen, Principal
Scientist at imec in Leuven, Belgium. "We are able to hit 25
µm-diameter micro-bumps with a high level of accuracy due to the
probe-to-pad alignment features of Cascade Microtech's CM300. And
advances in their Pyramid Probe technology have enabled us to probe
micro-bumped wafers with 40/50 µm pitch according to the JEDEC
Wide-I/O Mobile DRAM standard."
"Cascade Microtech's CM300 probe solution is designed to provide
greater alignment accuracy to probe directly on small, fragile
micro-bumps. In conjunction with a fine-pitch, low-force Pyramid
Probe card, we have achieved consistent, accurate measurements on a
wide I/O test wafer using a single-channel, wide I/O probe core
with an array of 6 x 50 tips at 40/50 µm pitch, with the ability to
shrink down to 20 µm pitches in the future," said Steve Harris,
Executive Vice President, Engineering, Cascade Microtech.
"Together, imec and Cascade Microtech are enabling the ongoing
future of CMOS technologies through this ground-breaking work. 3D
integration will undoubtedly result in increased performance and
yield while reducing overall costs."
About imec Imec performs world-leading
research in nanoelectronics. Imec leverages its scientific
knowledge with the innovative power of its global partnerships in
ICT, healthcare and energy. Imec delivers industry-relevant
technology solutions. In a unique high-tech environment, its
international top talent is committed to providing the building
blocks for a better life in a sustainable society. Imec is
headquartered in Leuven, Belgium, and has offices in Belgium, the
Netherlands, Taiwan, US, China, India and Japan. Its staff of more
than 2,000 people includes more than 650 industrial residents and
guest researchers. In 2012, imec's revenue (P&L) totaled 320
million euro. Further information on imec can be found at
www.imec.be.
Imec is a registered trademark for the activities of IMEC
International (a legal entity set up under Belgian law as a
"stichting van openbaar nut"), imec Belgium (IMEC vzw supported by
the Flemish Government), imec the Netherlands (Stichting IMEC
Nederland, part of Holst Centre which is supported by the Dutch
Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC
Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India
Private Limited).
About Cascade Microtech, Inc. Cascade
Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in precision
contact, electrical measurement and test of integrated circuits
(ICs), optical devices and other small structures. For technology
businesses and scientific institutions that need to evaluate small
structures, Cascade Microtech delivers access to electrical data
from wafers, ICs, IC packages, circuit boards and modules, MEMS, 3D
TSV, LED devices and more. Cascade Microtech's leading-edge
stations, probes, probe cards and integrated systems deliver
precision accuracy and superior performance both in the lab and
during production manufacturing of high-speed and high-density
semiconductor chips. For more information visit
www.cascademicrotech.com.
FOR MORE INFORMATION, CONTACT: Debbora Ahlgren Cascade
Microtech, Inc. (503) 601-1829 Debbora.Ahlgren@cmicro.com