CyberOptics Unveils WaferSense® Auto Resistance Sensor™ (ARS) at SEMICON Korea
January 16 2020 - 9:00AM
Business Wire
ARS significantly improves semiconductor yields
and tool uptime.
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will exhibit at SEMICON Korea from February 5-7th, 2020
at the COEX in Seoul, booth #C236. During the show, the company
will unveil and demonstrate its new WaferSense® Auto Resistance
Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool
set-up and diagnostics.
This press release features multimedia. View
the full release here:
https://www.businesswire.com/news/home/20200116005015/en/
CyberOptics WaferSense Auto Resistance
Sensor (Photo: CyberOptics Corporation)
The 300mm Auto Resistance Sensor (ARS) with CyberSpectrum
software enables real-time resistance measurements of plating cell
contacts in semiconductor Electrochemical Deposition (ECD)
applications. The ARS quickly identifies and monitors resistance
measurements with 50 separate pads around the perimeter utilizing a
Kelvin Sensing (4-wire resistance) method to detect residue
affecting plating pins.
Process and equipment engineers in semiconductor fabs can
predict when a tool needs maintenance with quantitative analysis of
measured mean resistance over time, shorten equipment maintenance
cycles, and improve cell-to-cell uniformity with the wafer-like,
4-wire resistance sensor and CyberSpectrum software’s objective and
repeatable data.
“We have extended our proprietary line of WaferSense devices
that are used by semiconductor fabs and equipment OEMs worldwide to
significantly improve yields and tool uptime,” said Dr. Subodh
Kulkarni, President and CEO, CyberOptics, “The new ARS can
wirelessly capture and monitor real-time resistance measurements
for the Electrochemical Deposition application in semiconductor
fabs. Similar to our other WaferSense devices, it can also save
time, expense and improve processes.”
CyberOptics will also demonstrate the WaferSense Auto Vibration
and Leveling Sensor (AVLS3). At only 3.5mm thick, AVLS3 can
travel with ease to most fab locations where a wafer travels. The
Chemically Hardened Glass (CHG) substrate enables smooth wafer
handling and improved vacuum chucking. AVLS3 with CyberSpectrum
software, collects and displays both vibration and leveling data
simultaneously for fast equipment set-up, alignment and real-time
equipment diagnostic.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor capital equipment
markets to significantly improve yields and productivity. By
leveraging its leading edge technologies, the Company has
strategically established itself as a global leader in high
precision 3D sensors, allowing CyberOptics to further increase its
penetration of key vertical markets. Headquartered in Minneapolis,
Minnesota, CyberOptics conducts worldwide operations through its
facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: market conditions in the global SMT
and semiconductor capital equipment industries; trade relations
between the United States and other countries; the timing of orders
and shipments of our products, particularly our 3D MRS-enabled AOI
systems; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 3D CMM system, products for
semiconductor advanced packaging inspection and metrology and
CyberGage360 product; costly and time consuming litigation with
third parties related to intellectual property infringement; and
other factors set forth in the Company’s filings with the
Securities and Exchange Commission.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20200116005015/en/
Carla Furanna Head of Global Marketing, CyberOptics
952-820-5837, cfuranna@cyberoptics.com
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