CyberOptics Introduces New In-Line Particle Sensor™ (IPS™) as an Extension of the Industry-Leading Particle Sensing Techn...
January 30 2020 - 9:00AM
Business Wire
IPS saves time, saves expense and improves
yields in semiconductor fabs
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will exhibit at SPIE Advanced Lithography from February
25-26, 2020 at the San Jose Convention Center in California, booth
#308. During the show, the company will introduce its new In-Line
Particle Sensor (IPS) with CyberSpectrum™ software for
semiconductor tool set-up and equipment diagnostics.
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the full release here:
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CyberOptics In-Line Particle Sensor (IPS)
and CyberSpectrum Software. (Photo: Business Wire)
An extension of the industry-leading WaferSense® and
ReticleSense® Airborne Particle Sensor (APS) technology that is
documented by fabs as the Best Known Method (BKM), the new In-Line
Particle Sensor (IPS) with CyberSpectrum software detects particles
in gas and vacuum lines 24/7 in semiconductor process equipment.
The IPS quickly identifies, monitors and enables troubleshooting of
particles down to 0.1µm.
The IPS can be installed in any gas or vacuum system, and is
particularly relevant for EUVL tools where the ability to monitor
particles in-line can significantly improve EUVL tool yield and
productivity. For example, it can be installed at the vacuum line
in between the EUV process chamber and the vacuum pump, saving
significant time compared to current methods of sending a monitor
dummy reticle into the system to check for particles before and
after sending the reticle into the EUVL. The IPS is always on and
collecting particle data, which is especially critical during
chamber purging.
“We have incorporated our proprietary airborne particle sensing
technology into an in-line form factor,” said Dr. Subodh Kulkarni,
President and CEO, CyberOptics, “The IPS delivers the same benefits
fabs worldwide have recognized with this proven technology. It can
significantly save time and expense while improving yields and
productivity.”
Process and equipment engineers in semiconductor fabs can speed
equipment qualification with real-time, 24-7 monitoring, compare
past and present data, as well as one tool to another.
Contamination sources can be identified quickly and the effects of
cleaning, adjustments and repairs can be seen in real-time. Fabs
can shorten equipment maintenance cycles, lower equipment expenses
and optimize preventative maintenance plans.
CyberOptics will also demonstrate the ReticleSense Airborne
Particle Sensor (APSRQ) and the ReticleSense Auto Multi Sensor
(AMSR) for wireless leveling, vibration, and relative humidity (RH)
measurements.
For more information, visit www.cyberoptics.com.
About CyberOptics CyberOptics Corporation
(www.cyberoptics.com) is a leading global developer and
manufacturer of high-precision 3D sensing technology solutions.
CyberOptics’ sensors are used for inspection and metrology in the
SMT and semiconductor capital equipment markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: market conditions in the global SMT
and semiconductor capital equipment industries; trade relations
between the United States and other countries; the timing of orders
and shipments of our products, particularly our 3D MRS-enabled AOI
systems; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 3D CMM system, products for
semiconductor advanced packaging inspection and metrology and
CyberGage360 product; costly and time consuming litigation with
third parties related to intellectual property infringement; and
other factors set forth in the Company’s filings with the
Securities and Exchange Commission.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20200130005090/en/
Carla Furanna Head of Global Marketing, CyberOptics
952-820-5837, cfuranna@cyberoptics.com
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