CyberOptics Demonstrates High-Precision Sensor Technology at Touch Taiwan
April 07 2021 - 9:00AM
Business Wire
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will showcase the In-Line Particle Sensor™ (IPS),
WaferSense® wireless measurement sensors and the NanoResolution
Multi-Reflection Suppression™ (MRS™) sensor for inspection and
metrology at the Touch Taiwan Exhibition on April 21-23rd at the
Taipei Nangang Exhibition Center in Taiwan in booth M330.
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CyberOptics' NanoResolution MRS Sensor
(Photo: Business Wire)
Cyberoptics’ In-Line Particle Sensor (IPS) with CyberSpectrum™
software detects particles in gas and vacuum lines 24/7 in
semiconductor process equipment and other controlled environments.
An extension of the industry-leading WaferSense® Airborne Particle
Sensor (APS) technology that is documented by fabs as the
Best-Known Method (BKM), the IPS quickly identifies, monitors and
enables troubleshooting of particles down to 0.1µm. Process and
equipment engineers can speed equipment qualification with 24/7
monitoring. They can compare past and present data, as well as one
tool to another, and see the effects of cleaning, adjustments and
repairs in real-time.
“The desire for a contamination-free process environment,
coupled with stringent manufacturing requirements are driving the
need for a best-in-class process to detect particles in gas and
vacuum lines,” said Dr. Subodh Kulkarni, President and CEO,
CyberOptics. “The IPS can quickly identify when and where particles
originate, as well as the source, saving significant time and
expense while maximizing yields and tool uptimes.”
The company will also display the NanoResolution MRS sensor that
is integrated into CyberOptics’ WX3000™ system for wafer-level and
advanced packaging inspection and metrology. It provides
sub-micrometer accuracy on features as small as 25µm. While
retaining its ability to reject spurious multiple reflections, it
adds the ability to capture and analyze specular reflections from
shiny surfaces of solder balls, bumps and pillars, providing highly
accurate inspection and metrology.
With data processing speeds in excess of 75 million 3D points
per second, the WX3000 system delivers production-worthy throughput
greater than 25 wafers (300mm) per hour. Complete 100% 3D/2D
inspection can be accomplished two to three times faster than
alternative technologies.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible world-wide recession or
depression resulting from the economic consequences of the COVID-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crisis on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D MRS
SQ3000 Multi-Function systems and MX systems for memory module
inspection; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function inspection and
measurement systems and products for semiconductor advanced
packaging inspection and metrology; costly and time consuming
litigation with third parties related to intellectual property
infringement; the negative impact on our customers and suppliers
due to past and future terrorist threats and attacks and any acts
of war; the impact of the MX3000 orders on our consolidated gross
margin percentage in any future period; risks related to
cancellation or renegotiation of orders we have received; and other
factors set forth in the Company’s filings with the Securities and
Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20210407005350/en/
Carla Furanna Vice President of Global Marketing, CyberOptics
952-820-5837, cfuranna@cyberoptics.com
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