CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit
August 04 2021 - 9:00AM
Business Wire
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will feature the WX3000™ metrology and inspection system
with MRS™ sensor technology, and high-precision sensors for
semiconductor tool set-up and diagnostics at the Virtual Connecting
Heterogeneous Systems Summit Sept. 1-3, 2021.
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the full release here:
https://www.businesswire.com/news/home/20210804005325/en/
WaferSense Auto Resistance Sensor (ARS)
(Photo: Business Wire)
Tim Skunes, CyberOptics VP of R&D, will share a presentation
‘Improving Plating Uniformity for Hybrid Bonding and Micro
Bumping,’ on Sept. 2nd at 8:50 a.m. ET/2:50 p.m. European CT.
Recent results have correlated copper thickness variations
across a wafer during electrochemical deposition (ECD) to
variations in metal dishing depth variations in hybrid bonding
applications. Copper pillar coplanarity is also correlated to ECD
plating uniformity in wafer bumping applications. The plating
uniformity during ECD is directly affected by plating cell contact
resistance. In-process monitoring of plating cell contact
resistance can accurately predict when preventive maintenance is
required to maintain thickness uniformity and save time and costs
associated with test wafer measurements. A real-time sensor for
measuring plating cell contact resistance will be presented.
The company will virtually demonstrate high-precision sensors
that process and equipment engineers use in the front-end of the
fab to speed equipment qualification, shorten equipment maintenance
cycles, lower equipment expenses and optimize preventative
maintenance plans. The WaferSense® Auto Resistance Sensor™ (ARS)
enables real-time resistance measurements of plating cell contacts
in semiconductor ECD applications.
The company also will virtually showcase the 3µm NanoResolution
Multi-Reflection Suppression™ (MRS™) sensor integrated into
CyberOptics’ WX3000™ system that provides sub-micrometer accuracy
on features as small as 25µm. While retaining its ability to reject
spurious multiple reflections, it adds the ability to capture and
analyze specular reflections from shiny surfaces of solder balls,
bumps and pillars, allowing highly accurate inspection and 3D
metrology of these critical packaging features. Fast, complete 100%
3D/2D inspection and bump metrology can be conducted with
throughput greater than 25 wafers (300mm) per hour.
“Fast, 100 percent metrology and inspection is needed now more
than ever for wafer-level and advanced packaging applications,”
said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Compared
to alternative technologies, our systems are 2-3X faster with the
high resolution and accuracy required to enable our customers to
recognize significant improvements in yields and processes.”
The SEMI Connected Heterogeneous Systems Summit brings together
thought leaders and industry experts from the entire 3D &
Systems and packaging and, MEMS/imaging/sensor value chain to
discuss the latest advancements in Heterogeneous Integration and
sensing technology driving innovation in high end applications.
CyberOptics is a gold sponsor.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible worldwide recession or
depression resulting from the economic consequences of the COVID-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crisis on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D MRS
SQ3000 Multi-Function systems and MX systems for memory module
inspection; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function systems and products
for semiconductor inspection and metrology; costly and time
consuming litigation with third parties related to intellectual
property infringement; the negative impact on our customers and
suppliers due to past and future terrorist threats and attacks and
any acts of war; the impact of the MX3000 orders on our
consolidated gross margin percentage in any future period; risks
related to cancellation or renegotiation of orders we have
received; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20210804005325/en/
Carla Furanna Vice President of Global Marketing, CyberOptics
952-820-5837, cfuranna@cyberoptics.com
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