CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
November 29 2021 - 9:00AM
Business Wire
Paper Titled ‘3D Inspection Is Becoming
Essential in Advanced Packaging (AP)’
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions will share a technical presentation at the Heterogeneous
Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
The company will also exhibit WaferSense® and ReticleSense® sensors
and feature the WX3000™ Metrology and Inspection system in booths
I3128, L0310, J2434 and K2106 at TaiNEX 1, Taipei, Dec 28-30th.
Dr. Charlie Zhu, Director of Engineering at CyberOptics, will
present ‘3D Inspection Is Becoming Essential in Advanced Packaging’
in the AP technical track on December 2nd at 3:30pm local time.
Advanced Packaging continues to be among the most dynamic and
rapidly evolving areas of semiconductor development and
manufacturing. Most of these new processes take advantage of the
third dimension, going vertical to continue packing more computing
power into less space while circumventing the difficulties posed by
further reductions in two-dimensional size.
As the processes and features they create have become smaller
and more complex, manufacturers face an increasing need for
high-precision inspection and measurement to detect defects and
improve process control. As a result, the traditional 2D-based
inspections can no longer satisfy the needs for quality control
where 3D inspection is becoming essential. A growing number of
applications in the AP process are requiring full 3D inspection
instead of sampling and the trend is expected to continue. However,
the traditional 3D inspection systems are either slow or inaccurate
which means they are unable to meet the growing demand of AP.
This presentation will elaborate on the needs and challenges of
3D inspection in various AP applications such as Wafer-Level
Packaging (WLP), System-in-Package (SiP) and Substrate Inspection,
and how CyberOptics’ disruptive Multi Reflection Suppression™(MRS™)
sensor technology can improve yields, processes and quality.
At the show, the company will feature the WX3000™ Metrology and
Inspection system powered by the 3 µm NanoResolution MRS sensor
that provides sub-micrometer accuracy on features as small as 25µm.
The system is specifically designed for wafer-level and advanced
packaging applications. While retaining its ability to reject
spurious multiple reflections, it adds the ability to capture and
analyze specular reflections from shiny surfaces of solder balls,
bumps and pillars, allowing highly accurate inspection and
metrology of these critical packaging features. Fast, 100% 3D/2D
inspection and metrology can be conducted with throughput greater
than 25 wafers (300mm) per hour, 2-3X faster than alternative
solutions.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading-edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible worldwide recession or
depression resulting from the economic consequences of the COVID-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crisis on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D MRS
SQ3000 Multi-Function systems and MX systems for memory module
inspection; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function systems and products
for semiconductor inspection and metrology; costly and time
consuming litigation with third parties related to intellectual
property infringement; the negative impact on our customers and
suppliers due to past and future terrorist threats and attacks and
any acts of war; the impact of the MX3000 orders on our
consolidated gross margin percentage in any future period; risks
related to cancellation or renegotiation of orders we have
received; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20211129005222/en/
Carla Furanna Vice President of Global Marketing
952-820-5837
CyberOptics (NASDAQ:CYBE)
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