Several New Customer Wins as TCB Gains Commercial
Momentum
New Path to Hybrid Bonding Demonstrated through
Fluxless TCB
K&S Joins Resonac-led "US-Joint"
Consortium
SINGAPORE, Aug. 7, 2024
/PRNewswire/ -- Kulicke and Soffa Industries, Inc.
(NASDAQ:
KLIC) ("Kulicke & Soffa", "K&S", or the
"Company") announced the introduction of its latest
APTURA™ Thermo-Compression platform in addition to three new
milestones relating to industry adoption of its chiplet-enabling
Thermo-Compression technology.
Recently, several of Kulicke & Soffa's leading
Thermo-Compression offerings have been selected at multiple
Assembly & Test customers. In support of the rapid needs for
advanced chiplet and stacked-die requirements, these tools will
support chip-to-substrate processes targeting applications such as
AI, HPC, Mobile and Edge-devices. K&S also continues to pursue
additional chip-to-wafer engagements and anticipates making further
customer announcements over the coming quarter as its
Thermo-Compression momentum, specifically in the area of Fluxless
Thermo-Compression bonding (FTC), continues.
Additionally, through industry collaborations with the UCLA
Center for Heterogeneous Integration and Performance Scaling
(CHIPS), as well as an FTC customer, Kulicke & Soffa's leading
APTURA™ platform has demonstrated an alternative path to
chip-to-wafer hybrid bonding, enabled by Thermo-Compression. This
innovative bumpless-FTC process creates a true chip-to-wafer,
hybrid-bond – supporting bonding for both bumpless,
Copper-to-Copper interconnects as well as dielectric materials –
for advanced logic applications. While direct Copper-to-Copper
bonding is a standard feature of the APTURA platform and gathering
broad market attention, this innovative new process further extends
the market access for Kulicke & Soffa's broadening portfolio of
Advanced Packaging solutions.
Finally, on July 8th,
Kulicke & Soffa's membership was announced within the
"US-Joint" consortium, formed by Resonac Holdings Corporation
("Resonac"), a leading provider of global semiconductor materials.
US-Joint is designed to support industry collaboration and market
adoption of advanced packaging solutions through research and
development and includes participation of ten American and Japanese
semiconductor materials and equipment providers. After the initial
establishment of two open consortiums in Japan known as "Joint" and "Joint 2", the
US-Joint represents the third Resonac-led consortium globally, and
the first within the US.
US-Joint includes the construction of an R&D facility based
in Silicon Valley, which will allow end-customers to verify the
latest requirements for advanced device packaging, and also
validate new concepts in development. Cleanrooms and equipment
installations for this Union City,
California based research center will initiate in calendar
year 2024, and are expected to be fully operational in 2025. A link
to the US-Joint announcement can be found here.
"Our TCB business has grown by over 10 times over the past four
years - faster than many other leading-edge interconnect processes
– due to our close customer engagements and industry collaborations
like these," stated John Molnar, VP
of Advanced Solutions, "The broadening adoption of both
Thermo-Compression technology, as well as emerging advanced
chiplet-based assembly architectures – throughout our broadly
served-markets – remains in early stages."
In support of the long-term industry needs for 2.5D and 3D
packaging approaches, which are extending Moore's law, K&S
anticipates to aggressively ramp customer engagements and
production capacity for FTC and bumpless FTC over the coming years.
In addition to Kulicke & Soffa's progress in Thermo-Compression
technology, High-Power-Interconnect (HPI) utilization in Automotive
and Industrials markets, Vertical-Fan-Out targeting dynamic memory
adoption, and the growing industry need for System-in-Package (SiP)
applications, provide additional growth opportunities over the
long-term.
About Kulicke & Soffa
Founded in 1951, Kulicke and Soffa Industries, Inc. specializes
in developing cutting-edge semiconductor and electronics assembly
solutions enabling a smarter and more sustainable future. Our
ever-growing range of products and services supports growth and
facilitates technology transitions across large-scale markets, such
as advanced display, automotive, communications, compute, consumer,
data storage, energy storage and industrial.
Contacts
Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
msim@kns.com
Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
investor@kns.com
View original
content:https://www.prnewswire.com/news-releases/kulicke--soffa-announces-thermo-compression-adoption--milestones-302216566.html
SOURCE Kulicke & Soffa Industries, Inc.