Electronic Design News (EDN) Names Interlink Electronics' MicroNav(TM) Ring to Hot 100 Products of the Year
March 06 2006 - 8:00AM
Business Wire
Interlink Electronics Inc. (NASDAQ:LINKE), a world leader in the
development of intuitive interface solutions and technologies,
announced today that Electronic Design News (EDN), published by
Reed Business Information, has named Interlink Electronics'
MicroNav Ring technology to its annual Hot 100 Products of the
year. Interlink's MicroNav Ring is a proprietary interface product
that provides intuitive menu scrolling to enhance the usability of
handheld electronic devices. In naming MicroNav Ring to their Hot
100 Products list, EDN's technical editors analyzed and compared
candidates from all of the products appearing in the pages of EDN
during 2005. "Over the course of a year, EDN covers an incredible
number of products spread across the breadth of the electronics
industry," states Editor in Chief, Maury Wright. "We choose the 100
that we think will prove most significant and useful to the design
engineer. Communications and multimedia were two of the leading
application areas in our selections this year, as consumer
electronics and audio-visual products continue to be the strongest
market drivers in technology." "The MicroNav Ring circular
scrolling interface solution offers unique advantages to consumers
and to the designers of handheld electronics products," adds Rod
Vesling, Vice President of Sales and Marketing, Interlink
Electronics, Inc. "To the consumer, MicroNav Ring provides an
intuitive circular menu scrolling wheel that enables quick access
to device content and functions. To the design engineer, it
provides a robust user interface rugged enough for typical use in
outdoor environments. MicroNav Ring is also cost-effective and
versatile, supporting direct integration with the device host
processor and allowing the use of metallic actuators, EL and LED
lighting, and more. MicroNav Ring is a very low power consumption
technology." MicroNav Ring is a member of Interlink Electronics'
MicroNav family of proprietary interface products. Utilizing the
company's patented Force Sensing Resister(R) (FSR) technology,
MicroNav interface solutions enable circular menu scrolling, 360
degree "mouse" navigation and pressure switch sensing for handheld
consumer electronics including mobile phones, MP3 players, remote
controls and more. More information on Interlink's MicroNav family
of products, which includes the MicroNav Ring, MicroNav 360 degree,
MicroNav Array, MicroNav Strip and MicroNav Touchpad, is available
at http://www.micronavlink.com. About EDN EDN is published by Reed
Business Information (www.reedbusiness/us.com), the largest
business-to-business publisher in the U.S. and a member of the Reed
Elsevier Group plc (NYSE: RUK and ENL) - a world-leading publisher
and information provider operating in the science and medical,
legal, education and business-to-business industry sectors. Known
as the "Voice of the engineer," Waltham, MA-based EDN serves the
vital information needs of design engineers and engineering
managers worldwide. The EDN franchise includes EDN, EDN Europe, EDN
Asia, EDN Australia, EDN China, EDN Japan, and EDN.com. For more
information on EDN's Hot 100 Products award, see EDN's December 16,
2005 issue and at http://www.edn.com/051216cs About Interlink
Electronics, Inc. Interlink Electronics, Inc. (NASDAQ:LINKE) is a
world leader in the development of intuitive interface technologies
and solutions for business and home applications. Creating today's
interface standards, our business communications, e-transactions,
home entertainment and specialty components businesses have
established Interlink as the comprehensive source for branded and
OEM solutions. Selected customers include Dell, HP/Compaq, InFocus,
Microsoft, Mitsubishi, NEC, Sanyo, Sharp, Sony and Toshiba.
Recognized worldwide for innovative interface technologies and
solutions, Interlink Electronics, Inc. serves an international
customer base from its corporate headquarters in Camarillo,
California and offices in Tokyo, Hong Kong and China. The Company
currently holds numerous patents on sensor technologies,
e-signature technologies, wireless communication protocols and
product design properties. See Interlink Electronics online at
http://www.interlinkelectronics.com/ or in Japan at
http://www.interlinkelec.co.jp/ All registrations and trademarks
are properties of their respective owners. This document contains
forward-looking statements that involve a number of risks and
uncertainties. The following are among the factors that could cause
actual results to differ materially from the forward-looking
statements: business conditions and growth in the electronics
industry and general economies, both domestic and international;
lower than expected customer orders; delays in receipt of orders or
cancellation of orders; competitive factors, including increased
competition, new product offerings by competitors and price
pressures; the availability of third party parts and supplies at
reasonable prices; changes in product mix; significant quarterly
performance fluctuations due to the receipt of a significant
portion of customer orders and product shipments in the last month
of each quarter; and product shipment interruptions due to
manufacturing problems. The forward-looking statements contained in
this document regarding industry and revenue trends, industry
product and technology acceptance, product mix and future business
activities should be considered in light of these factors.
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