Amkor and PSi Sign Patent License Agreement
December 13 2004 - 7:30AM
PR Newswire (US)
Amkor and PSi Sign Patent License Agreement CHANDLER, Ariz. and
SOUTH SAN FRANCISCO, Calif., Dec. 13 /PRNewswire-FirstCall/ --
Amkor Technology, Inc. (NASDAQ:AMKR) and PSi Technologies Holdings,
Inc. (NASDAQ:PSIT) have signed a broad, multi-year patent license
agreement that allows PSi to practice under Amkor's portfolio of
MicroLeadFrame(R) patents and will grant Amkor access to the
intellectual property being developed by PSi related to its
PowerQFN(TM) technology. MicroLeadFrame(R), or MLF(R), is Amkor's
proprietary version of an integrated circuit package with the
generic nomenclature of QFN, which stands for "quad, flat-pack, no
lead." Amkor's MLF(R) package is a lead frame-based, nearly
chip-scale package with an exposed die paddle and leads on the
bottom of the package, providing excellent thermal and electrical
performance. Introduced in the late 1990s, Amkor's
MicroLeadFrame(R) package has seen accelerating adoption by IC
suppliers as a cost-effective alternative for conventional low
lead-count packages. In the past three years, Amkor has shipped
more than two billion MLF(R) packages. According to Terry Davis,
Amkor's vice president for MicroLeadFrame(R) packages, "This
agreement recognizes Amkor's substantial investment in MLF(R)
technology and intellectual property." PSi's PowerQFN(TM)-type
package utilizes heavy aluminum wire, solder die attach, clip leads
and an encapsulated Molded Array Package Singulation (MAPS)
approach, geared specifically for the higher voltage and thermal
requirements of the power semiconductor market. PowerQFN packages
with solder die attach and clip-leads have enhanced electrical
device performance through reduced parasitics and thermal
resistance. PSi anticipates beginning production on its PowerQFN
family of packages during the first quarter of 2005. "The
introduction of a QFN-type package represents an ongoing commitment
by PSi to develop products that meet increasingly sophisticated and
demanding packaging requirements of PSi's power semiconductor
customers," said Arthur J. Young, Jr., Chairman & CEO of PSi
Technologies. "This agreement, which provides PSi with the
flexibility and option to utilize Amkor's MLF(R) patents according
to the thermal and voltage requirements of PSi's customers, is a
key step towards fulfilling PSi's Packaging Power Solutions(TM)
commitment." About Amkor: Amkor Technology, Inc. is a leading
provider of contract semiconductor assembly and test services. The
company offers semiconductor companies and electronics OEMs a
complete set of microelectronic design and manufacturing services.
More information on Amkor is available from the company's SEC
filings and on Amkor's web site: http://www.amkor.com/. About PSi
Technologies: PSi Technologies is a focused independent
semiconductor assembly and test service provider to the power
semiconductor market. The company provides comprehensive package
design, assembly and test services for power semiconductors used in
telecommunications and networking systems, computers and computer
peripherals, consumer electronics, electronic office equipment,
automotive systems and industrial products. Their customers include
most of the world's major power semiconductor manufacturers. More
information on PSi is available from the company's SEC filings and
on PSi's web site: http://www.psitechnologies.com/. Amkor Contacts:
Jeffrey Luth Martijn Pierik Amkor Technology, Inc. Positio Public
Relations, Inc. Phone: 480-821-2408 ext. 5130 Phone: (408) 453-2400
PSi Technologies Contacts: Edison G. Yap, CFA Amy Cozamanis PSi
Technologies Holdings Financial Relations Board Phone: (63 917) 894
1335 Phone: (310) 854-8314 Safe Harbor Statement This press release
contains forward-looking statements made by Amkor and PSi that
involve risks and uncertainties. These statements include, but are
not limited to, the duration of the license agreement between Amkor
and PSI and the anticipated production of the PowerQFN family of
packages beginning in the first quarter of 2005. Actual results and
outcomes may differ materially. Factors that might cause a
difference include, but are not limited to, the terms and
conditions of the license agreement between Amkor and PSI, factors
relating to the pace of development and market acceptance of PSi's
products and the power semiconductor market generally,
commercialization and technological delays or difficulties, the
impact of competitive products and technologies, competitive
pricing pressures, manufacturing risks, the possibility of PSi's
products infringing patents and other intellectual property of
third parties, product defects, costs of product development,
manufacturing and government regulation, risks inherent in emerging
markets, including but not limited to, currency volatility and
depreciation, restricted access to financing and political and
social unrest. PSi and Amkor undertake no responsibility to update
these forward-looking statements to reflect events or circumstances
after the date hereof. More detailed information about potential
factors that could affect the financial results of Amkor and PSi is
included in the documents filed by Amkor and PSi from time to time
with the Securities and Exchange Commission. DATASOURCE: Amkor
Technology, Inc.; PSi Technologies Holdings, Inc. CONTACT: Jeffrey
Luth of Amkor Technology, Inc., +1-480-821-2408 ext. 5130, ; or
Martijn Pierik of Positio Public Relations, Inc., +1-408-453-2400,
, for Amkor Technology, Inc.; or Edison G. Yap, CFA, of PSi
Technologies Holdings, (63 917) 894 1335, ; or Amy Cozamanis of
Financial Relations Board, +1-310-854-8314, , for PSi Technologies
Holdings, Inc. Web site: http://www.amkor.com/
http://www.psitechnologies.com/
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