SuperGaN-based SiP Family Now Includes Three
Devices, Expanding Power Level Support for a Wider Range of Next
Generation Adapters and Chargers
Transphorm, Inc. (Nasdaq: TGAN), a global leader in robust GaN
power semiconductors, and the global leader in adapter USB Power
Delivery (PD) Controller Integrated Circuits (IC) Weltrend
Semiconductor Inc. (TWSE: 2436) today announced availability of two
new GaN System-in-Packages (SiPs). When combined with Weltrend’s
flagship GaN SiP announced last year, the new devices establish the
first SiP product family based on Transphorm’s SuperGaN®
platform.
The new SiPs—WT7162RHUG24B and WT7162RHUG24C—integrate
Weltrend’s high frequency multi-mode (QR/Valley Switching) Flyback
PWM controller with Transphorm's 150 mΩ and 480 mΩ SuperGaN FETs
respectively. Like their 240 mΩ predecessor (WT7162RHUG24A), the
devices pair with USB PD or programmable power adapter controllers
to provide a total adapter solution. Notably, they also offer
several innovative features including the UHV valley tracking
charge mode, adaptive OCP compensation, and adaptive green mode
control among others that allow customers to design high quality
power supplies faster and with fewer components using the simplest
design approach.
“When we launched our first GaN SiP last year, it was an
important milestone in our company’s evolution. It demonstrated a
new GTM strategy for the AC-to-DC power market,” said Wayne Lo,
Vice President of Marketing, Weltrend. “Today’s news confirms we’re
continuing to serve that space with a wider selection of devices
designed to support a wider assortment of product power levels. A
total packaged solution with Transphorm’s SuperGaN platform
delivers design simplicity with unparalleled performance for
devices now ranging from low 30-watt USB-C PD power adapters
through to nearly 200-watt chargers, a unique Transphorm GaN
capability.”
End product manufacturers seek ways to develop new adapters with
a reduced bill-of-materials (BOM) that offer versatility, fast
charging, and higher power outputs. Additionally, in many cases
they seek to deliver “one-size-fits-all” chargers with multiple
ports and/or multiple types of connections. All of this in smaller,
lighter weight form factor.
Some key advantages of Transphorm’s normally-off d-mode SuperGaN
platform include best-in-class robustness (+/- 20 V gate margin
with a 4 V noise immunity) and reliability (< 0.05 FIT) with the
ability to increase power density by 50% over silicon. Weltrend’s
elegant SiP designs harness those advantages along with its own
innovative technologies to create a near plug-and-play solution
that speeds design while reducing form factor size.
“SiPs are an important device option when considering the needs
of adapter and charger manufacturers,” said Tushar Dhayagude, Vice
President of Worldwide Sales and FAE, Transphorm. “These systems
require effective power conversion that, while simple to use with
integrated functionality, also minimize learning curves to ensure
quick design in. The first device released validated the
performance and versatility of a SuperGaN SiP. The new devices
announced today validate both our companies’ deepening commitment
to arming customers with choice.”
Key Specifications
WT7162RHUG24A
WT7162RHUG24B (new)
WT7162RHUG24C (new)
Rds(on)
240 mΩ
150 mΩ
480 mΩ
Vds min
650 V
Power Efficiency
> 93%
Power Density
26 w/in3
Max Frequency
180 kHz
Wide Output Voltage
Operation
USB-C PD 3.0 PPS 3.3V~21V
Package
24-pin 8x8 QFN
Key Features
Feature
Advantage
Adjustable GaN FET gate slew rate
control
Balances out efficiency and EMI
compliance
External VDD linear regulator circuit not
required (700 V ultra HV start-up current pulled directly from AC
Line voltage)
Reduces component count
Reduced package inductance
Maximizes chip performance
Fits in a standard 8x8 QFN FF
Allows for low profile/small system
footprint
Target Applications and Availability
Weltrend’s SuperGaN SiP family is optimized for use in
high-performance, low-profile USB-C power adapters for mobile/IoT
devices such as smartphones, tablets, laptops, headphones, drones,
speakers, cameras, and more.
Additional device specifications are detailed in the datasheets
here:
- WT7162RHUG24A (240 mΩ):
http://www.weltrend.com/en-global/product/detail/67/124/610
- WT7162RHUG24B (150 mΩ):
http://www.weltrend.com/en-global/product/detail/67/124/633
- WT7162RHUG24C (480 mΩ):
http://www.weltrend.com/en-global/product/detail/67/124/634
The two new devices (WT7162RHUG24B and WT7162RHUG24C) are
currently sampling. Contact sales@weltrend.com.tw for more
information.
About Transphorm
Transphorm, Inc., a global leader in the GaN revolution, designs
and manufactures high performance and high reliability GaN
semiconductors for high voltage power conversion applications.
Having one of the largest Power GaN IP portfolios of more than
1,000 owned or licensed patents, Transphorm produces the industry’s
first JEDEC and AEC-Q101 qualified high voltage GaN semiconductor
devices. The Company’s vertically integrated device business model
allows for innovation at every development stage: design,
fabrication, device, and application support. Transphorm’s
innovations move power electronics beyond the limitations of
silicon to achieve over 99% efficiency, 50% more power density and
20% lower system cost. Transphorm is headquartered in Goleta,
California and has manufacturing operations in Goleta and Aizu,
Japan. For more information, please visit www.transphormusa.com.
Follow us on Twitter @transphormusa and WeChat at
Transphorm_GaN.
About Weltrend Semiconductor Inc.
Founded in 1989 in the "Silicon Valley of Taiwan," the Hsinchu
Science Park, Weltrend Semiconductor, Inc. (TWSE: 2436) is a
leading fabless semiconductor company specializing in the planning,
design, testing, application development, and distribution of
mixed-signal/digital IC products in power supplies, motor controls,
image processing, and more across multiple applications. For more
information, please visit www.weltrend.com.
The SuperGaN mark is a registered trademark of Transphorm, Inc.
All other trademarks are the property of their respective
owners.
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version on businesswire.com: https://www.businesswire.com/news/home/20240424484796/en/
Press Contact: Heather Ailara +1.973.567.6040
heather.ailara@transphormusa.com
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