Trikon Eyes Market Opportunities: Company Focusing
March 17 2005 - 2:36PM
PR Newswire (US)
Trikon Eyes Market Opportunities: Company Focusing Proven
Production Technology Across Four Semiconductor Markets NEWPORT,
Wales, March 17 /PRNewswire-FirstCall/ -- Senior executives at
Trikon Technologies, Inc. (NASDAQ:TRKN) today reported that the
company's business strategy has been aligned to maximize its proven
production technology leadership in "mainstream silicon" IC
manufacturing by applying focus to four key segments in
semiconductor and nanotechnology fabrication: 1) "Mainstream
silicon" and power management applications; 2) Memory applications
including new non-volatile approaches such as MRAM; 3)
Communications covering III-V based high speed electronics and Bulk
Acoustic Wave device manufacture; and 4) Emerging technologies in
the fields of MEMS and wafer level packaging techniques. "Our
four-pronged strategy spreads our product offerings across multiple
needs in the semiconductor industry," said Dr. John Macneil,
president and CEO of Trikon. "The advantage is that this strategy
gives us significant market opportunities to leverage our
production leadership and it should help to balance the effects of
the industry's cyclical markets. For example, even with the
industry currently in a down cycle, we are seeing significant
market opportunities for power management applications and the ramp
in BAW device production is also realizing a lot of activity. In
addition, our flowable oxide technology for sub 65 nm memory
manufacturing is being evaluated by several fabs looking for
leading-edge solutions that they will need for the next technology
node." 'Mainstream silicon' and power fabrication Tools Remove Risk
For Producers of Cost Sensitive Semiconductors "Mainstream silicon"
production involves proven technology nodes that can be ramped
quickly to profitable production with little development and
pilot-lining; low cost, high reliability process tools are crucial.
By focusing our proven deposition and etch technologies on
"mainstream silicon" fabs, Trikon addresses the needs of
manufacturers of cost-sensitive semiconductors who are not best
served by equipment suppliers focused just on the leading
technology nodes. This is a win-win strategy because it is
providing Trikon with a significant market opportunity and it has
the proven 200-mm deposition and plasma etch technologies that
"mainstream silicon" fabs need to expand or enhance their
productivity. Also included in "mainstream silicon" applications is
the specialist segment of power management. They share a number of
common traits with "mainstream silicon" providers; requiring
flexible processing tools, low operating cost, low risk and fast
ramp to production, but they do have significant processing
requirements that require the vendor to develop new techniques and
understanding. "We have invested a great deal of resource into
power technology, and now have a leading position in trench etch on
our Omega product family, thick metal deposition up to 20 um on the
Sigma PVD tool, and backside solder metal solutions on wafers
thinned to
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