Tower Semiconductor Sets a New RFSOI Standard with Broadcom’s Wi-Fi RF Front-End Modules for Next-Gen Mobile Applications
September 10 2024 - 6:00AM
Leading-Edge Wi-Fi 7 RF FEMs based on
Tower’s Advanced 300mm RFSOI Technology Deliver Enhanced Mobile
Connectivity Performance and Efficiency
MIGDAL HAEMEK, Israel, Sept 10,
2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading
foundry of high-value analog semiconductor solutions, today
announced the production of Wi-Fi 7 RF front-end module (FEM)
devices based on its advanced 300mm RFSOI technology. Partnering
with Broadcom Inc. (NASDAQ: AVGO), Tower has enabled fully
integrated Wi-Fi FEM devices on a single RFSOI die. This innovative
solution delivers superior performance and efficiency compared to
existing non-SOI technologies, setting a new standard in the market
for advanced mobile applications.
“The unique advantages of Tower’s RFSOI
technology have enabled Broadcom to design and bring to market a
set of compact, high-performance FEMs for Wi-Fi 7 mobile
applications," said Vijay Nagarajan, vice president of
Marketing, Wireless Communications and Connectivity,
Broadcom. "These FEMs - a product of our long-standing
partnership with Tower - are tailored to meet the stringent size
and power efficiency requirements for mobile Wi-Fi
applications."
"We are thrilled to collaborate with a market
leader like Broadcom, extending Tower’s leading RFSOI platform to
enable innovative architectural options for integrated front-end
module designs, including unique devices for LNAs and power
amplifiers, and high gate density standard cells for size reduction
in logic area,” said Dr. Marco Racanelli, President, Tower
Semiconductor. “Broadcom’s premier capabilities in RF FEM
product design complement our technological strengths, allowing
both companies to achieve unprecedented performance and
integration. This partnership underscores our dedication to
aligning roadmaps with our customers and advancing groundbreaking
products, reinforcing Tower's commitment to delivering superior
technology and manufacturing solutions, enabling customers’
success."
This highly integrated process reduces chip area
despite the complexity of having to support new features and
frequency bands. Tower’s RFSOI technology platform delivers
best-in-class silicon-based switch and LNA performance, as
evidenced by its widespread adoption. Integrating a PA device into
this technology eliminates the additional signal loss of
propagating signals between separate dies, while the
high-resistivity SOI substrate enhances PA efficiency by supporting
passive elements like inductors with a higher quality factor.
For additional information on Tower’s RF &
HPA technology platform, please visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM),
the leading foundry of high-value analog semiconductor solutions,
provides technology, development, and process platforms for its
customers in growing markets such as consumer, industrial,
automotive, mobile, infrastructure, medical and aerospace and
defense. Tower Semiconductor focuses on creating a positive and
sustainable impact on the world through long-term partnerships and
its advanced and innovative analog technology offering, comprised
of a broad range of customizable process platforms such as SiGe,
BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging
sensors, displays, integrated power management (BCD and 700V),
photonics, and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
process transfer services including development, transfer, and
optimization, to IDMs and fabless companies. To provide multi-fab
sourcing and extended capacity for its customers, Tower
Semiconductor owns two facilities in Israel (150mm and 200mm), two
in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns
through its 51% holdings in TPSCo, shares a 300mm facility in
Agrate, Italy, with ST as well as has access to a 300mm capacity
corridor in Intel’s New Mexico factory. For more information,
please visit: www.towersemi.com.
Tower Semiconductor Investor Relations
Contact: Noit Levy | +972-4-604-7066 |
noitle@towersemi.comTower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
- Tower_Broadcom_PR_Final_091024
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