Verigy Adds Direct-Probe™ Solution to its V93000 Platform for the Wafer-Level CSP Market
June 29 2010 - 4:05PM
Business Wire
Verigy (NASDAQ:VRGY), a leading semiconductor test company, has
extended the scalability of its production-proven V93000 platform
by adding the Direct-Probe™ solution. This high-performance probe
test capability for digital, mixed-signal and wireless
communication ICs delivers one of the highest signal integrity
levels available for production-volume, multi-site probe
testing.
The innovative new Direct-Probe RF solution reduces the cost of
test for radio-frequency (RF), high-pin-count digital and complex
mixed-signal devices, addressing the global semiconductor market’s
rapid shift to performance probe test and wafer-level chip scale
packages (WLCSP). By removing the conventional mechanical interface
between the wafer and tester, Verigy’s V93000 platform equipped
with the Direct-Probe RF solution reduces the length and number of
signal-path connections, significantly improving signal integrity
for RF device testing.
The V93000 with Direct-Probe RF solution can be designed to use
a single-load board for both wafer probe and final test. This
reduces the time between IC development and production, minimizes
the correlation effort between probe and final test, and enables
high multi-site capability. Verigy’s Direct-Probe RF capability
also provides the largest component area for application use while
maintaining planarity of ±1 mm over a 44,000-square-millimeter
area.
In addition, V93000 Direct-Probe solutions offer full platform
compatibility with all tester configurations while the V93000’s
scalable architecture provides the versatility to test the full
spectrum of RF-based semiconductor devices.
“As wafer-level chip scale packaging gains momentum, testing
currently done with handlers on singulated packaged devices is
moving to multi-site, non-singulated testing on wafer probers,”
said Hans-Juergen Wagner, Verigy’s vice president of SOC test
solutions. “Essentially, this means that device packaging is
becoming the last step in wafer processing, driving final testing
onto the probe line. Addressing this trend, we believe our new
Direct-Probe RF solution delivers the industry’s highest
performance for wafer probing and provides the lowest cost of test
while maximizing test resources for a broad range of ICs including
wireless devices used in Bluetooth products, global positioning
systems and wireless LANs (local area networks).”
About Verigy
Verigy provides advanced semiconductor test systems and
solutions used by leading companies worldwide in design validation,
characterization, and high-volume manufacturing test. Verigy offers
scalable platforms for a wide range of system-on-chip (SOC) test
solutions, and memory test solutions for Flash, DRAM including
high-speed memories, as well as multi-chip packages (MCP). Verigy
also provides advanced analysis tools that accelerate design debug
and yield ramp processes. Additional information about Verigy can
be found at www.verigy.com.
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