Infineon Highlights Innovative Hybrid Electric Vehicle Power Modules at Electric Vehicle Symposium
December 03 2007 - 8:00AM
Marketwired
ANAHEIM, CA this week, Infineon Technologies AG (FRANKFURT: IFX)
(NYSE: IFX) is showing innovative power electronics technologies
that reduce the size and weight of the motor drive systems of
hybrid electric vehicles (HEVs). Infineon semiconductor components
and HybridPACK power modules, which have been selected for use in
new HEVs by manufacturers around the world, are shown in a
demonstrator electric cart and in static displays in the company's
booth (#673).
In typical HEVs, the size and weight of power modules are key
determinants of the electric motor drive system size and weight.
The Infineon HybridPACK modules are dramatically smaller (as much
as 25 percent) compared to other power modules providing the same
output power, and they offer several performance advantages.
Infineon uses its Trench Fieldstop? IGBT and Emcon diode
technologies to achieve industry-leading high current density.
These devices are highly efficient and therefore convert more power
for the same battery input power. Additionally, the devices can
operate at 150degreeC maximum junction temperature, which
eliminates the need for an additional coolant loop for HEVs.
Finally, the Infineon modules combine innovative design practices,
improved ceramic substrate and enhanced process technologies to
achieve automotive reliability without using expensive base-plate
material.
"Development of an optimal design for HEV power modules requires
a unique combination of know-how in power semiconductors,
electronic controls and automotive systems," said Christopher Cook,
general manager of the Automotive, Industrial and Multimarket
Business Group of Infineon Technologies North America Corp. "We've
drawn on expertise in microcontrollers, sensors and power devices
to produce very cost-effective solutions that will enable
manufacturers to make HEVs available in a wider variety of
automobile models and offer consumers more choices for
energy-efficient transportation."
Availability
Infineon HybridPACK modules are available in different
configurations for different types of applications, including
micro-, mild- and full-hybrid vehicles. The modules, power
components, microcontrollers and sensors shown at EVS 23 are now
available to automotive manufacturers and component suppliers. For
further information on the portfolio of Infineon products for HEVs
and energy efficient transportation applications, please see:
www.infineon.com/hybrid.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, communications,
and security. In the 2007 fiscal year (ending September), the
company reported sales of Euro 7.7 billion (including Qimonda sales
of Euro 3.6 billion) with approximately 43,000 employees worldwide
(including approximately 13,500 Qimonda employees). With a global
presence, Infineon operates through its subsidiaries in the U.S.
from Milpitas, CA, in the Asia-Pacific region from Singapore, and
in Japan from Tokyo. Infineon is listed on the Frankfurt Stock
Exchange and on the New York Stock Exchange (ticker symbol:
IFX).
Further information is available at www.infineon.com.
All trademarks are the property of their respective
companies.
This news release is available online at
http://www.infineon.com/news/
Media Relations Technology: U.S.A. Agnes Toan +1 408 503 2587
agnes.toan@infineon.com
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