Infineon Introduces the World's Smallest Fully Integrated Receive Front-End Module for GPS Applications
October 13 2008 - 11:46AM
Marketwired
Infineon Technologies AG (FRANKFURT: IFX) (NYSE: IFX) today
introduced the world's smallest GPS Receive Front-End Module. The
new BGM681L11 includes all key components to amplify a GPS signal
and filter out interference in a module occupying just 3.75 mm(3),
which is more than 60 percent smaller than the closest competitor
product. Key components of the GPS Receive Front-End Module include
one GPS Low Noise Amplifier (LNA) and integrated filters with high
ESD ruggedness.
"GPS functionality will be a standard feature for the next
generations of mobile phones. With this highly integrated GPS
Receive Front-End Module, the BGM681L11, Infineon helps handset
manufacturers fulfill the toughest space requirements," said
Michael Mauer, Senior Marketing Director Silicon Discretes at
Infineon Technologies. "Infineon is committed to continue
developing a strong portfolio of completely integrated GPS receive
front-end modules."
The GPS Receive Front-End Module BGM681L11 incorporates
Infineon's GPS LNA chip and two integrated filters with high ESD
ruggedness, an input and output filter, in a tiny leadless TSLP11-1
package that measures just 2.5 mm x 2.5 mm x 0.6 mm in size. This
package is more than 60 percent smaller than the closest competitor
offering with similar integration level. Alternatively, the GPS LNA
chip is also available as the stand-alone device BGA615L7 based on
silicon germanium process technology. Today, more than 70 million
units of that LNA have already been shipped to the GPS market.
The main challenges for the growing mobile GPS market are to
achieve higher sensitivity and higher immunity against interference
of cellular signals. This means that LNAs and filters are becoming
indispensable components for the GPS receive front-end line-up. As
more and more features are added to new generations of high-end
mobile phones, PCB space becomes the main limiting factor, so
front-end modules of small size are highly desirable. According to
the market research company IMS Research the GPS market segment is
growing with a compound average growth rate (CAGR) of 33.7 percent
until 2011. Consequently, GPS will be featured in at least one
third of all mobile phones to be produced in 2011.
"With the GPS Receive Front-End Module BGM681L11 Infineon
complements its broad range of high-performance GPS LNAs by
providing fully integrated receive front-end components," said
Michael Mauer, Senior Marketing Director Silicon Discretes at
Infineon Technologies. "By making use of our recently announced
SiGe:C-LNAs capable of 1.8 V operation and CMOS RF-Switches,
Infineon is further expanding its product portfolio of GPS modules
and underlining its leading position in the GPS market."
Availability, Package and Pricing
The BGM681L11 GPS Receive Front-End Module is available in
high-volume quantities. Infineon provides evaluation kits. Pricing
of the BGM681L11 starts at a 10,000-piece price of USD 1.20. The
BGM681L11 is shipped in a tiny leadless TSLP11-1 package of only
2.5 mm x 2.5 mm x 0.6 mm in size.
Further technical information on the GPS Receive Front-End
Module is available at www.infineon.com/BGM681L11
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, communications,
and security. In the 2007 fiscal year (ending September), the
company reported sales of Euro 7.7 billion (including Qimonda sales
of Euro 3.6 billion) with approximately 43,000 employees worldwide
(including approximately 13,500 Qimonda employees). With a global
presence, Infineon operates through its subsidiaries in the U.S.
from Milpitas, CA, in the Asia-Pacific region from Singapore, and
in Japan from Tokyo. Infineon is listed on the Frankfurt Stock
Exchange and on the New York Stock Exchange (ticker symbol:
IFX).
Further information is available at www.infineon.com.
This news release is available online at
www.infineon.com/press/
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Media Relations Technology: Worldwide Headquarters Monika
Sonntag +49 89 234 24497 monika.sonntag@infineon.com U.S.A. Mitch
Ahiers +1 408 503 2791 mitch.ahiers@infineon.com
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