Rudolph Technologies Focuses on High Value Solutions for High Growth Markets at SEMICON China
March 08 2018 - 6:00PM
Business Wire
Solutions include inspection, metrology,
lithography, probe card test and software for rapidly growing
applications in IoT, AI, FPD and more
Rudolph Technologies, Inc. (NYSE: RTEC) will present a broad
portfolio of innovative solutions for front-end wafer fabrication,
advanced packaging and display manufacturing, during SEMICON and
FPD China, March 14-16, at the Shanghai New International Expo
Centre.
“Rudolph is a prominent exhibitor at this show,” said Vincent
Wang, general manager of Rudolph Technologies China. “We’ll be
there in full force in three different booths, along with our
Chinese partners, Simax AT and Zen Voce Corporations. Rudolph will
present a wide array of high value solutions for many of today’s
high growth applications, including: IoT, AI, AMOLED, and 3D
NAND.”
Hall N2 #2655 – Total Process Control for Wafer Fabrication
and Advanced Packaging
Rudolph will highlight total process control for semiconductor
manufacturing and advanced packaging, with solutions for integrated
defect inspection and metrology; defect analysis, classification
and review; and lithography, including:
- Truebump™ Technology on the Dragonfly™
Inspection System - fast, accurate and repeatable three-dimensional
(3D) metrology for all advanced packaging bumping applications,
from copper (Cu) pillar, to microbumps, and even large C4
bumps.
- Clearfind™ Technology on the Firefly™
Inspection System - detects defects that are almost impossible to
find using conventional imaging techniques – helping to
significantly reduce yield-robbing failures in both front- and
back-end manufacturing processes.
- Yield analysis, data management and
defect classification software - critical to controlling and
improving yield.
- JetStep Lithography Systems - a
revolutionary exposure tool specifically-designed to meet advanced
packaging challenges, including the ability to handle a variety of
substrate shapes and sizes.
In addition, Rudolph’s Director of Technology Development and
Applications, Priya Mukundhan will present, “Monitoring Critical
Process Steps in 3D NAND and Advanced RF using Picosecond
Ultrasonic Metrology,” at the China Semiconductor Technology
International Conference (CSTIC), Symposium VI: Metrology,
Reliability and Testing, on 12 March.
Hall N2 #2381 – Probe Card Test & Analysis for
Semiconductor Devices
Automated probe card test and repair is used to monitor probe
card health to ensure cards are ready and capable of testing
semiconductor devices. Rudolph’s systems can measure critical card
metrics, such as tip position, tip size, tip planarity, contact
resistance, and electrical continuity.
Hall N1 #1213 – Lithography for Display Manufacturing
Featured products for flat panel display manufacturing include
the JetStep® G45 lithography system, fab-wide yield management
software for intelligent diagnostics, fab-wide fault detection and
classification software and automatic defect classification.
Rudolph’s Vice President of Business Development, Elvino da
Silveira, will present, “A Novel Lithography Approach to Overcome
the Next Generation Flexible AMOLED Production Challenges” at the
2018 China Display Conference Emerging Display Forum on 14
March.
“Consumer demand for high-quality displays is driving rapid
adoption of AMOLED and creating new manufacturing challenges as the
industry works to increase production,” said da Silveira. “We will
present our novel lithography solution for AMOLED panels, which
reduces tooling cost and operating expenses, resulting in superior
value of ownership for the customer.”
For more information about Rudolph’s total process control and
lithography solutions, visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design,
development, manufacture and support of defect inspection,
lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling
microelectronic device manufacturers to drive down costs and time
to market of their devices. Headquartered in Wilmington,
Massachusetts, Rudolph supports its customers with a worldwide
sales and service organization. Additional information can be found
on the Company’s website at www.rudolphtech.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20180308006292/en/
Rudolph Technologies, Inc.Trade Press:Amy Shay,
+1-952.259.1794amy.shay@rudolphtech.comorLocal office:Wendy
Wang, +86-21-609.306.00Wendy.Wang@Rudolphtech.com
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