Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology
April 29 2013 - 5:30AM
Business Wire
Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and
GLOBALFOUNDRIES Inc. today announced a joint technology development
and production agreement for 40 nanometer (nm) embedded flash
(eFlash) process technology. The cooperation will focus on
technology development based on Infineon’s eFlash cell design and
manufacturing of automotive and security microcontrollers (MCUs)
with 40nm process structures. Production of the next generation
40nm eFlash MCUs will take place at different GLOBALFOUNDRIES
sites, initially in Singapore with subsequent transfer to its site
in Dresden, Germany.
“Next generation embedded Flash microcontrollers with 40nm
process structures will further enhance our competitive strength in
the automotive as well as chip card and security markets,” says
Arunjai Mittal, Member of the Management Board of Infineon
Technologies. “We trust in GLOBALFOUNDRIES with their excellent
manufacturing background and sites on different continents to
fulfill Infineon’s stringent quality, infrastructure security and
business continuity requirements.”
“Infineon’s decision to choose GLOBALFOUNDRIES as the foundry
partner for the 40nm embedded Flash technology node recognizes our
unique ability to offer one-foundry-solutions supported by multiple
fabs in different geographies,” says Ajit Manocha, CEO
GLOBALFOUNDRIES. “We are committed to providing leading-edge
technology and manufacturing capabilities required to support
Infineon’s business. We are looking forward to a long-term
collaboration with Infineon and to contribute to their success in a
very dynamic industry.”
This agreement with GLOBALFOUNDRIES is consistent with
Infineon’s strategy to engage in technology co-development for
CMOS-based technologies in 65nm and below. Process and product
qualification for security microcontrollers is planned for the
second half of 2015. Automotive microcontroller production start is
scheduled for the first half of 2017.
Infineon and GLOBALFOUNDRIES have a longstanding relationship in
development and manufacturing, including joint development and
manufacturing of CMOS-based low-power mobile phone products.
About GLOBALFOUNDRIES
GLOBALFOUNDRIES is the world’s first full-service semiconductor
foundry with a truly global footprint. Launched in March 2009, the
company has quickly achieved scale as the second largest foundry in
the world, providing a unique combination of advanced technology
and manufacturing to more than 160 customers. With operations in
Singapore, Germany and the United States, GLOBALFOUNDRIES is the
only foundry that offers the flexibility and security of
manufacturing centers spanning three continents. The company’s
three 300 mm fabs and five 200 mm fabs provide the full range of
process technologies from mainstream to the leading edge. This
global manufacturing footprint is supported by major facilities for
research, development and design enablement located near hubs of
semiconductor activity in the United States, Europe and Asia.
GLOBALFOUNDRIES is owned by the Advanced Technology Investment
Company (ATIC). For more information, visit
http://www.globalfoundries.com.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, mobility, and
security. In the 2012 fiscal year (ending September 30), the
Company reported sales of Euro 3.9 billion with close to 26,700
employees worldwide. Infineon is listed on the Frankfurt Stock
Exchange (ticker symbol: IFX) and in the USA on the
over-the-counter market OTCQX International Premier (ticker symbol:
IFNNY).
This news release is available online at www.infineon.com/press
and at www.globalfoundries.com/newsroom.
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