Beyond Liquid Cooling: Boyd Strengthens AI Cooling Innovation Capabilities with Durbin Group Acquisition
July 10 2024 - 8:00AM
Business Wire
Boyd Acquires the Durbin Group to Enhance its
Liquid Cooling System Technology Portfolio with Advanced Two-Phase
Liquid Cooling Capabilities that Address Thermal Requirements of
Next-Generation AI Processors
Boyd’s latest acquisition, the Durbin Group, strengthens Boyd’s
innovation capabilities in liquid cooling system technologies
critical for high-performance compute, artificial intelligence
(AI), and advanced data centers. Boyd has solved thermal challenges
in data centers since the advent of microprocessors. Boyd’s latest
thermal innovations in liquid cooling have helped our customers
accelerate their rapid transition from traditional air cooled to
liquid cooled racks. Boyd has extensive liquid system design
experience having shipped over 40 thousand liquid cooling systems
to high-performance compute, hyperscaler, and semiconductor
customers. Boyd also designs and manufactures liquid cold plates
which cool processors and complement the liquid cooling system. To
date, Boyd has shipped to key enterprise customers over 4 million
liquid cold plates incorporated into 1 million liquid loops.
The Durbin Group has a long, trusted history designing advanced
liquid cooling systems for enterprise, aerospace, and defense
markets. These systems cool high-performance compute, power
conversion, and directed energy applications. The latest AI,
defense, and data center applications require single-phase liquid
cooling technology, but next-generation designs require even more
sophisticated two-phase liquid cooling technologies. The Durbin
Group’s expertise and heritage in single and two-phase liquid
cooling systems will enhance Boyd’s development efforts to address
current and next-generation thermal management needs.
“We’re investing in strong engineering talent to expand Boyd’s
liquid system design capacity and accelerate our liquid cooling
system development. Significant market growth in high-performance
data centers and artificial intelligence will continue for the
foreseeable future, and this demand requires liquid cooling to
scale,” said Boyd CEO Doug Britt. “We are a global leader in the
design and manufacturing of liquid systems, cold plates and liquid
cooling loops that directly cool high-power microprocessors. Our
liquid cooling systems have cooled high-reliability semiconductor,
defense, and medical applications for decades. We are well
positioned to deliver complete, optimized, leak-free liquid cooling
systems to AI customers at scale.”
About Boyd
Boyd is the trusted global innovator of sustainable solutions
that make our customers’ products better, safer, faster, and more
reliable. Our innovative engineered materials and thermal solutions
advance our customers’ technology to maximize performance in the
world’s most advanced data centers; enhance reliability and extend
range for electric and autonomous vehicles; advance the accuracy of
cutting-edge personal healthcare and diagnostic systems; enable
performance-critical aircraft and defense technologies; and
accelerate innovation in next-generation electronics and
human-machine-interface. Core to Boyd’s global manufacturing is a
deep commitment to protect the environment with sustainable,
scalable, lean, strategically located regional operations that
reduce waste and minimize carbon footprint. We empower our
employees, develop their potential, and inspire them to do the
right things with integrity and accountability to champion our
customers’ success.
Visit us at www.boydcorp.com.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20240710283918/en/
Media Contact: Amie Jeffries Boyd
amie.jeffries@boydcorp.com