DreamBig's open MARS Chiplet Platform
with a leading Chiplet HubTM for scale-up
and Networking IO Chiplets for scale-out enables customers to
compose the most advanced AI solutions
- DreamBig empowers customers to forge the future of AI,
datacenter, edge, storage, 5G and automotive solutions that are
composable and scalable to meet their application specific
needs
- DreamBig is leading 3D HBM stacking on the Chiplet
HubTM, resulting in significant performance and
efficiency gains for systems that are memory bandwidth dominated
such as generative AI accelerators
- DreamBig revolutionizes chiplet ecosystem with its
industry-leading platform, enabling customers to focus on
development of differentiating chiplet-based technologies built
around the Chiplet HubTM, and bring complete
system-in-package or accelerator card products to market,
regardless of scale
SAN
JOSE, Calif., July 16,
2024 /PRNewswire/ -- DreamBig Semiconductor Inc., a
pioneer in high-performance accelerator platforms utilizing its
industry-leading Chiplet Hub™ with 3D HBM, today announced a
$75M equity funding round. This round
was co-led by the Samsung Catalyst Fund and the Sutardja Family.
New investors include Samsung, Hanwha, Event Horizon, and Raptor,
alongside continuing contributions from existing stakeholders
including the Sutardja Family, UMC Capital, BRV, Ignite Innovation
Fund, Grandfull Fund, amongst others.
![DreamBig DreamBig](https://mma.prnewswire.com/media/2461633/DreamBig_Logo.jpg)
These funds will bolster the development and commercialization
of products built on DreamBig's Chiplet Hub™ and Platform Chiplets.
"This investment underscores the market's recognition of DreamBig
as a transformative force in AI and data center infrastructure,"
stated Sohail Syed, Co-founder and
CEO of DreamBig. "Our open MARS Chiplet Platform enables
unparalleled scale-up and scale-out solutions so customers can
achieve the highest levels of performance and energy efficiency at
lowest cost and fastest time-to-market."
"We are delighted to co-lead DreamBig's Series B round and
partner with an exceptional team leading the path to streamline
chiplet-based AI solutions," said Marco
Chisari, Head of Samsung Semiconductor Innovation Center and
Executive Vice President, Samsung Electronics. "The ever-growing
demands for intensive workloads and memory-bound applications –
from generative AI to automotive – are fueling the need for more
advanced chiplet-based designs with 3D HBM stacking."
The Chiplet Hub™ and Networking Chiplets deliver highly
differentiated capabilities:
- Universal architecture support for CPU, AI, Accelerators, IO,
Networking, and Memory Chiplets within a unified platform
- Memory-First Architecture for direct access from all chiplets
to 3D stacked HBM, DDR, CXL, and SSD memory tiers
- FLC Technology Group fully associative hardware acceleration
for Cache/Memory management
- DMA hardware for efficient memory data transfer from any source
to any destination managed by the Chiplet Hub
- Virtual PCIe/CXL switch for optimized resource allocation
- Ethernet/UEC RDMA hardware for enhanced scalability
- Multi-Gigabit, low power Content Addressable Memory for
precision Match/Action processing at 800Gbps
"We are extremely proud of DreamBig's accomplishments and its
open MARS Chiplet platform with world leading Chiplet
HubTM for scale-up and Networking IO Chiplets for
scale-out enables customers to compose the most advanced AI
solutions with UCIe/BoW compliant Chiplets leveraging Silicon
Box Panel Level Packaging for the masses",
stated Sehat Sutardja and Weili Dai,
Co-founders and Chairman/Chairwoman of DreamBig. "It is our passion
and determination to drive innovation by offering the most advanced
technology for the new era of semiconductor Chiplet solutions
globally. In the last several years, we have cofounded and invested
in numerous companies to develop disruptive technologies which
DreamBig has leveraged to lead the pack for the new Chiplet
era."
About DreamBig
Founded in 2019, DreamBig is developing a cutting-edge chiplet
platform that drives the next wave of affordable, scalable, and
modular semiconductor solutions for the AI era and beyond. DreamBig
is renowned for providing the most advanced Chiplet Hub,
facilitating the scaling of processor, accelerator, and networking
chiplets. The company's specialties include applications in Large
Language Models (LLMs), Generative AI, Data Centers, Edge
computing, and Automotive sectors.
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SOURCE DreamBig Semiconductor, Inc.