BANGALORE, India, Aug. 7, 2024
/PRNewswire/ -- Copper Plating Solutions for Semiconductor
Manufacturing Market is Segmented by Type (Acidic, Alkaline),
by Application (Damascene, Chip Substrate Plating (CSP), Through
Silicon Via (TSV), Wafer Level Packaging (WLP), Others): Global
Opportunity Analysis and Industry Forecast, 2024-2030.
The Global Copper Plating Solutions for Semiconductor
Manufacturing Market is projected to reach 830 USD million in 2030, increasing from
450 USD million in 2023, with a CAGR
of 8% during the period of 2024 to 2030.
Claim Your Free Sample Now:
https://reports.valuates.com/request/sample/QYRE-Auto-7J15319/Global_Copper_Plating_Solutions_for_Semiconductor_Manufacturing_Market_Research_Report_2023
Major Factors Driving the Growth of Copper Plating Solutions
for Semiconductor Manufacturing Market:
The continuous shrinking and performance improvement of
semiconductor devices are fueling a rapidly growing demand for
copper plating solutions in the semiconductor manufacturing
industry. Because copper has excellent electrical conductivity and
dependability, it is a necessary component in the manufacturing of
sophisticated printed circuit boards (PCBs) and integrated circuits
(ICs). Fine conductive patterns, which are essential for
high-performance and high-density electronic devices, may be
created by this procedure. The semiconductor industry is depending
more and more on sophisticated copper plating methods to satisfy
the increasingly demanding standards for quicker, smaller, and more
efficient electronic devices. Further supporting the market's
expansion are technical developments in copper plating methods,
such as through-silicon via (TSV) and 3D packaging, which make it
possible to create more complex and compact semiconductor
designs.
Unlock Insights: View Full Report Now!
https://reports.valuates.com/market-reports/QYRE-Auto-7J15319/global-copper-plating-solutions-for-semiconductor-manufacturing
TRENDS INFLUENCING THE GROWTH OF THE COPPER PLATING SOLUTIONS
FOR SEMICONDUCTOR MANUFACTURING MARKET
The Damascene method, which is necessary to create fine copper
interconnections in semiconductor devices, depends heavily on
acidic copper plating solutions. Excellent conductivity and
dependability are provided by these solutions, which are essential
for cutting-edge microelectronic systems. In order to provide
effective electrical channels, the Damascene method entails etching
trenches and vias into a dielectric substance and then filling them
with copper. Acidic copper plating solutions are essential for
creating high-density interconnections because of their excellent
filling properties and low void formation. The market is driven
ahead by the growing need for more powerful and compact
semiconductor devices, which in turn raises the need for efficient
copper plating solutions for the Damascene process.
Because they offer improved plating performance and
adaptability, alkaline copper plating solutions are propelling
expansion in the copper plating solutions market for semiconductor
production. The consistent thickness distribution, enhanced
adhesion qualities, and decreased stress in the deposited copper
layers provided by these methods are critical for the reliability
and functionality of semiconductor components. Advanced packaging
technologies can benefit from the alkaline process since it makes
plating intricate geometries and through-holes easier. Adoption of
alkaline solutions is further aided by their environmental
advantages over acidic solutions, which include reduced toxicity
and simpler waste handling. Alkaline copper plating is one of the
dependable and eco-friendly copper plating solutions that is in
high demand due to the increasing complexity and miniaturization of
semiconductor devices, which is driving the market's expansion.
By improving the efficiency and dependability of semiconductor
devices, Chip Substrate Plating (CSP) is having a major impact on
the expansion of copper plating solutions in the semiconductor
manufacturing industry. In order to provide a strong electrical
connection between the semiconductor die and the packaging, copper
is deposited onto substrates in CSP. For high-performance
applications, effective heat dissipation and electrical
conductivity are essential, and this method is key to achieving
both. The adoption of CSP is being fueled by the growing need for
improved packaging solutions, which is being driven by developments
like 5G technology, artificial intelligence (AI), and the Internet
of Things (IoT). The market for copper plating solutions in
semiconductor manufacturing is driven by the accurate and efficient
copper deposition made possible by modern plating solutions, which
guarantee the creation of high-quality, dependable semiconductor
devices.
One of the main factors driving the market for copper plating
solutions is the ongoing quest for semiconductor device downsizing.
Finer and more dependable copper interconnections are required as
electronic devices get bigger and more powerful. For current
microchips to have the high-density interconnections they need,
copper plating methods are essential. Copper is essential for
producing tiny semiconductor components because of its excellent
electrical conductivity and suitability for intricate designs.
Consumer desire for quicker, smaller, and more energy-efficient
electronic gadgets is driving this trend toward downsizing. This in
turn is driving the need for sophisticated copper plating solutions
that can satisfy these demanding specifications.
The expansion of copper plating solutions in semiconductor
production is being driven by the growing need for high-performance
computing, or HPC. Applications such as scientific research,
financial modeling, and artificial intelligence rely on
high-performance and reliable semiconductor devices for HPC
systems. The high-density connections required for these potent
computer systems must be made using copper plating solutions.
Copper is perfect for use in HPC devices because of its capacity to
control heat and conduct electricity with efficiency. The need for
sophisticated copper plating solutions that can satisfy the
exacting specifications of HPC applications is rising along with
the need for more potent and effective computing solutions.
Own It Today – Buy Now!
https://reports.valuates.com/api/directpaytoken?rcode=QYRE-Auto-7J15319&lic=single-user
COPPER PLATING SOLUTIONS FOR SEMICONDUCTOR MANUFACTURING
MARKET SHARE ANALYSIS
Because of its substantial electronics manufacturing base and
rising consumer electronics demand, Asia-Pacific is a particularly important
market. The requirement for cutting-edge semiconductor devices
utilized in a variety of applications, from consumer electronics to
industrial automation, is what drives the regional need for copper
plating solutions. The need for copper plating solutions will
increase in tandem with regional markets' continued development and
investment in semiconductor production, hence bolstering the
expansion of the worldwide market.
Purchase Chapters:
https://reports.valuates.com/market-reports/QYRE-Auto-7J15319/global-copper-plating-solutions-for-semiconductor-manufacturing/1
Key Players:
- Entegris
- Umicore
- ATMI
- Moses Lake Industries
- Enthone
- Shanghai Sinyang Semiconductor Materials
- MKS (Atotech)
- PhiChem Corporation
- RESOUND TECH INC.
- Technic Inc
- DuPont
Purchase Regional Data:
https://reports.valuates.com/market-reports/QYRE-Auto-7J15319/global-copper-plating-solutions-for-semiconductor-manufacturing/3
SUBSCRIPTION
We have introduced a tailor-made subscription for our customers.
Please leave a note in the Comment Section to know about our
subscription plans.
DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!
- The global market for Copper Plating Electrolyte and
Additives was estimated to be worth USD
461.6 million in 2023 and is forecast to a readjusted size
of USD 793.5 million by 2030 with a
CAGR of 8.1% during the forecast period 2024-2030
- Plastic Copper Plating Market
- Copper Electroplating Additives Market
- Highly Conductive Copper Plate Market
- Photovoltaic Copper Plating Exposure Machine Market
- Silver Plated Copper Strip Market
- IGBT Module Copper Base Plate Market
- The global Silver Plated Copper Wire market was
valued at USD 526.7 million in 2023
and is anticipated to reach USD 737.1
million by 2030, witnessing a CAGR of 5.2% during the
forecast period 2024-2030.
- The global Semiconductor Plating Chemicals
market is projected to reach USD 1577.9
million in 2029, increasing from USD
1040 million in 2022, with the CAGR of 5.5% during the
period of 2023 to 2029.
- The global market for Plating Equipment was
estimated to be worth USD 1058.3
million in 2023 and is forecast to a readjusted size of
USD 1911.8 million by 2030 with a
CAGR of 8.5% during the forecast period 2024-2030
- PCB Plating Chemicals Market
- Copper Foil for FPC Market
- Electrolytic Copper Market
- Copper Anodes Market
- The global Electroless Plating market is projected
to reach USD 5377.8 million by 2030
from an estimated USD 4477.7 million
in 2024, at a CAGR of 3.1% during 2024 and 2030.
- Decorative Plating Additives Market
- Copper Cathode Market
- The electroplating market was valued at
USD 18.3 billion in 2022, and is
estimated to reach USD 27.2 billion
by 2032, growing at a CAGR of 4% from 2023 to 2032.
- The global Roll-Annealed (RA) Copper Foil
market was valued at USD 525.3
million in 2023 and is anticipated to reach USD 635.5 million by 2030, witnessing a CAGR of
2.7% during the forecast period 2024-2030.
- The global Oxygen Free Copper market is projected
to reach USD 11300 million by 2030
from an estimated USD 8927.6 million
in 2024, at a CAGR of 4.0% during 2024 and 2030.
- Semiconductor Track System market is projected to
reach USD 5749.5 million in 2029,
increasing from USD 3756 million in
2022, with a CAGR of 6.3% during the period of 2023 to 2029.
- Semiconductor Manufacturing Equipment Market
- The global Power Semiconductor market was valued at
USD 46070 million in 2022 and is
anticipated to reach USD 66420
million by 2029, witnessing a CAGR of 5.3% during the
forecast period 2023-2029.
- The global Semiconductor Fabrication Software
market was valued at USD 5929.2
million in 2023 and is anticipated to reach USD 6709.5 million by 2030, witnessing a CAGR of
1.8% during the forecast period 2024-2030.
- Semiconductor Equipment Refurbishment Market
- The global Precursor for Semiconductor market was
valued at USD 2373 million in 2023
and is anticipated to reach USD 5452.6
million by 2030, witnessing a CAGR of 10.9% during the
forecast period 2024-2030.
- The global Semiconductor Electronic Part Manufacturing
market was valued at USD 6780
million in 2023 and is anticipated to reach USD 9477.6 million by 2030, witnessing a CAGR of
7.1% during the forecast period 2024-2030.
- The global Spares Parts Manufacturing for Semiconductors
market is projected to reach USD 67290
million in 2029, increasing from USD
45650 million in 2022, with the CAGR of 5.6% during the
period of 2023 to 2029.
- The global Semiconductor Chip
Handler market is projected to grow from USD 990.8 million in 2024 to USD 1843.2 million by 2030, at a Compound Annual
Growth Rate (CAGR) of 10.9% during the forecast period.
- The global Semiconductor Foundry Service market was
valued at USD 113420 million in 2023
and is anticipated to reach USD 196540
million by 2030, witnessing a CAGR of 8.0% during the
forecast period 2024-2030.
- The global Automotive Semiconductor market size is
projected to reach USD 42140 million
by 2028, from USD 31430 million in
2021, at a CAGR of 3.8% during 2022-2028.
- The global Predictive Maintenance (PDM) for
Semiconductor Manufacturing market was valued at USD 496 million in 2023 and is anticipated to
reach USD 908 million by 2030,
witnessing a CAGR of 9.7% during the forecast period 2024-2030.
- The global Vacuum Components for Semiconductor
Manufacturing market is projected to reach USD 5096.8 million in 2029, increasing from
USD 3511 million in 2022, with the
CAGR of 5.7% during the period of 2023 to 2029.
- The global Surface Treatment Solutions for Semiconductor
Equipment Parts market is projected to reach USD 2956.1 million in 2029, increasing from
USD 1936.4 million in 2022, with the
CAGR of 6.5% during the period of 2023 to 2029.
- The global AMHS for Semiconductor market was valued
at USD 2643.1 million in 2023 and is
anticipated to reach USD 4767.1
million by 2030, witnessing a CAGR of 8.6% during the
forecast period 2024-2030.
- The global Power Discrete Semiconductor market was
valued at USD 33670 million in 2023
and is anticipated to reach USD 46680
million by 2030, witnessing a CAGR of 6.5% during the
forecast period 2024-2030.
- The global Plastic Parts for Semiconductor Equipment
market is projected to reach USD 644.2
million in 2029, increasing from USD
456.4 million in 2022, with the CAGR of 5.0% during the
period of 2023 to 2029.
- global Cleaning & Coating for Semiconductor
Equipment Parts market is projected to reach USD 2468.3 million in 2029, increasing from
USD 1636.4 million in 2022, with the
CAGR of 6.5% during the period of 2023 to 2029.
- The global Semiconductor Backend Equipment
market was valued at USD 39700
million in 2023 and is anticipated to reach USD 69360 million by 2030, witnessing a CAGR of
7.8% during the forecast period 2024-2030.
- The big data analytics in semiconductor &
electronics market was valued at USD
18.7 billion in 2021, and is estimated to reach USD 47.2 billion by 2031, growing at a CAGR of
9.9% from 2022 to 2031.
- The global Semiconductor Chemical Distribution Systems
market is projected to reach USD 1027.7
million in 2029, increasing from USD
589 million in 2022, with the CAGR of 8.7% during the period
of 2023 to 2029.
DISCOVER OUR VISION: VISIT ABOUT US!
Valuates offers in-depth market insights into various
industries. Our extensive report repository is constantly updated
to meet your changing industry analysis needs.
Our team of market analysts can help you select the best report
covering your industry. We understand your niche region-specific
requirements and that's why we offer customization of reports. With
our customization in place, you can request for any particular
information from a report that meets your market analysis
needs.
To achieve a consistent view of the market, data is gathered
from various primary and secondary sources, at each step, data
triangulation methodologies are applied to reduce deviance and find
a consistent view of the market. Each sample we share contains a
detailed research methodology employed to generate the report.
Please also reach our sales team to get the complete list of our
data sources.
YOUR FEEDBACK MATTERS: REACH OUT TO US!
Valuates Reports
sales@valuates.com
For U.S. Toll-Free Call 1-(315)-215-3225
WhatsApp: +91-9945648335
Website: https://reports.valuates.com
Blog: https://valuatestrends.blogspot.com/
Pinterest: https://in.pinterest.com/valuatesreports/
Twitter: https://twitter.com/valuatesreports
Facebook: https://www.facebook.com/valuatesreports/
YouTube: https://www.youtube.com/@valuatesreports6753
https://www.facebook.com/valuateskorean
https://www.facebook.com/valuatesspanish
https://www.facebook.com/valuatesjapanese
https://valuatesreportspanish.blogspot.com/
https://valuateskorean.blogspot.com/
https://valuatesgerman.blogspot.com/
https://valuatesreportjapanese.blogspot.com/
Logo:
https://mma.prnewswire.com/media/1082232/Valuates_Reports_Logo.jpg
View original
content:https://www.prnewswire.com/news-releases/copper-plating-solutions-for-semiconductor-manufacturing-market-size-to-grow-usd-830-million-by-2030-at-a-cagr-of-8---valuates-reports-302216870.html
SOURCE Valuates Reports