Thintronics Inc. Closes Its Series A Extension
August 14 2024 - 5:06PM
Business Wire
Thintronics Inc. closed its Series A Extension having added M
Ventures, the CVC arm of Merck KGaA, TGVP, the US CVC arm of TOPPAN
Holdings, and previous investor Tallwood Venture Capital to the
Thintronics Series A syndicate. The series was led by Maverick
Capital and Translink Capital.
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the full release here:
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Thintronics unified electronics
insulators (Graphic: Thintronics)
Thintronics Inc. is a California-based electronic materials
startup supplying high-performance insulators for emerging AI
datacenter, networking, and RF/millimeter-wave (mmW)
applications.
The company was founded on the idea that conventional
assumptions guiding insulator material development limited the
capacity of the industry to innovate. They have since developed a
suite of high-performance materials that display electrical and
mechanical characteristics that far outpace the state of the art.
Thintronics’ CEO Stefan Pastine points out that "the interconnect
insulator is foundational to modern electronics; however, it has
yet to be optimized to operate near the theoretical limit of
insulation. Additionally, the supply chain is fragmented across
multiple electronic architectures. It is our vision to optimize the
insulator and unify it across the fabric."
The company’s insulators remain stable at high frequencies using
a new generation of isotropic, skew-free, ultra-low loss, and low
Dk dielectric materials. They can be applied as ultra-thin coatings
directly onto chips and interconnects. The coatings act as an
advanced insulation layer, minimizing signal loss and energy
dissipation in high-speed data channels. Benefits include
significant reductions in data center energy loss from
electromagnetic radiation and heat dissipation. A further benefit
results from Thintronics moving away from the need for fiber glass
to provide structural rigidity for PCBs, allowing new levels of
flexibility for high performance boards and semiconductors.
The addition of M Ventures, TGVP and Tallwood delivers
significant strategic advantages for Thintronics. M Ventures brings
an important partnership with Merck KGaA, one of the leading
semiconductor materials providers in the market and a global player
in science, technology and manufacturing worldwide. TGVP brings
Thintronics into TOPPAN’s ecosystem. TOPPAN is a leading global
supplier of semiconductor packaging materials and a significant
user of insulator materials for the sector. Along with Tallwood, a
California based long-term semiconductor investor and an early
Thintronics funder, the addition of these partners provides the
company with important strategic intelligence into its target
markets and significant technical and innovation resources that can
accelerate and compliment their commercialization efforts.
According to TGVP’s Issei Kusano, Thintronics "achieves
outstanding electronic and mechanical properties. TOPPAN's
semiconductor back-end business has the potential to unlock and
expand the value of Thintronics. As this collaboration comes to
fruition, it is expected to revolutionize the packaging
market.”
M Ventures’ Owen Lozman expressed confidence in Thintronics
technology emphasizing that “the timing couldn’t be better for
Thintronics at the very moment when data and compute demand at
scale has run up against technical obstacles. Only material
innovation can address these fundamental challenges, and we are
proud to support this vision of disruptive breakthrough at the core
of modern electronics.”
Thintronics’ CEO Stefan Pastine added that “It is incredibly
exciting to have additional support with deep expertise and
strategic insights in semiconductor materials and semiconductor
packaging. I would like to thank Daniel Franke, Owen Lozman, Yuhei
Yano, Ed L., and Yoji Kawaguchi for believing in our vision, our
Team and our Technology.”
Tristan El Bouayadi, Thintronics’ CTO, underlined the value of
these new partnerships to the company when "the market has a real
need for simpler integration schemes with higher performance
requirements (in terms of Signal Integrity, Power Integrity and
Thermomechanical Reliability). Harnessing the networking effect
from semiconductor material suppliers to packaging Fabs and OSAT
will enable Thintronics to make this a reality. Practically
speaking, Thintronics will act as an ecosystem enabler for
architectures such as Interposer-less 2.1D, Chiplets and
Heterogeneous Co-packaging. This investment aligns perfectly with
our technical and commercial roadmap.”
ABOUT MAVERICK CAPITAL
Maverick Capital is a global investment firm that has been
investing in early-stage companies for over 30 years. By working
with Maverick, early and growth stage entrepreneurs get the best of
both worlds – a focused, agile team of venture partners – and the
resources, reputation and relationships of a multi-billion-dollar
manager.
ABOUT TRANSLINK CAPITAL
Headquartered in Palo Alto, California, Translink Capital is an
early-stage venture capital firm investing in technology-based
startups in the enterprise, infrastructure, sustainability, and
robotics sectors. Founded in 2006, the firm has over $1 billion of
assets under management and has been engineered to bring founders
and their innovative companies together with a unique set of global
resources and networks to support their journey to build
foundational companies in their sector.
ABOUT M VENTURES
M Ventures is the strategic, corporate venture capital fund of
Merck KGaA, Darmstadt, Germany, investing in Biotechnology and
Technology. They cover the areas of Healthcare drug development,
Life Science tools, Electronics and Frontier Technology &
Sustainability.
ABOUT TGVP
TGVP is the US Corporate Venture Capital arm of TOPPAN, Inc.
Founded in 2022, the San Mateo based firm is focused on venture
capital investments in US startup companies in Sustainability and
Digital Transformation.
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James@thintronics.com