KAOHSIUNG, Aug. 26,
2024 /PRNewswire/ -- E&R (8027.TWO), an advanced
Laser & Plasma Provider, marks its 30th anniversary with
significant advancements in technology and research. At SEMICON
Taiwan 2024, E&R will present several core themes, including
glass substrates as a critical material for next-generation
advanced packaging, Fan-Out Panel Level Packaging (FOPLP), along
with their latest laser and plasma technologies, and Raman
inspection solutions for advanced packaging processes.
Glass Substrate Solutions & Ecosystem
Leveraging its self-developed TGV technology, E&R has formed
the E-Core System Glass Substrate ecosystem, a consortium of
top-tier local semiconductor equipment, vision and inspection
equipment providers, semiconductor materials, and key component
manufacturers. Together, they have developed the core technology
for glass substrates—Glass Core processing. For the first time,
E&R will publicly showcase a 515*510mm glass core sample, a
collaborative achievement by the alliance, which encompasses
processes such as laser modification, wet etching, and seed layer
sputtering. This marks the first public result of joint efforts by
local Taiwanese companies.
Additionally, E&R offers laser beveling and laser polishing
specifically designed for glass laser cutting after ABF (Ajinomoto
Build-up Film).
FOPLP Fan-Out Panel Level Packaging
E&R provides mature, mass-production equipment for FOPLP
(Fan-Out Panel Level Packaging) processes, with sizes ranging from
300*300mm to 700*700mm. This includes laser marking, laser
cutting, plasma cleaning after drilling, de-smear, laser debonding,
post-debond plasma descum, and ABF drilling. With excellent warpage
handling capabilities up to 16mm, the equipment ensures
high-efficiency output.
Plasma Dicing – Small Die Dicing
E&R offers a hybrid solution combining laser grooving and
plasma dicing, with precise control of cutting channels between
10μm and 30μm. Beyond equipment manufacturing, E&R also
provides an all-in-one small die dicing service, enabling the
processing of wafers into small dies of various shapes, such as
hexagons, circles, or MPR shapes, meeting diverse customer
needs.
You are cordially invited to visit E&R at SEMICON Taiwan
2024, Booth #N0968, 4F, Taipei Nangang Exhibition Center Hall 1, to
explore the latest trends in advanced packaging process
technology.
SEMICON Taiwan 2024 - E&R Booth Information
- Location: Taipei Nangang Exhibition Center Hall 1
- Booth Information: 4F, #N0968
- Date: September 4-6,
2024
- https://www.enr.com.tw/
CONTACT: leolee@enr.com.tw
View original content to download
multimedia:https://www.prnewswire.com/news-releases/er-to-showcase-glass-substrates-and-advanced-technologies-at-semicon-taiwan-2024-302230194.html
SOURCE E&R Engineering Corp