SUNNYVALE, Calif., Sept. 3,
2024 /PRNewswire/ -- Blue Cheetah Analog Design and
LG Electronics Inc. (LG) announced that they are collaborating and
have demonstrated silicon success for a new generation of chiplets
that can potentially be used in LG's future AI-enabled products.
The successful silicon bring-up of a complex System-in-Package
(SiP), including chiplets with processors, DDR memory interfaces,
AI accelerators, and Blue Cheetah's die-to-die (D2D) interconnect,
marks a significant milestone in the partnership.
LG, a global leader in innovative consumer electronics and home
appliances, used Blue Cheetah's BlueLynx D2D interconnect IP for
its multi-chiplet design. Blue Cheetah provides its
state-of-the-art IP solutions in 16nm, 12nm, 7nm, 6nm, 5nm, 4nm,
and below across multiple semiconductor foundries. The IP supports
versatile packaging options, including standard and advanced,
supporting multiple bump pitches, metal stacks, and orientations.
The physical (PHY) IP solutions
integrate with on-die buses using popular standards like
AMBA® CHI, AXI, and ACE.
"We chose Blue Cheetah because the company offers the fastest,
lowest-risk path to customized chiplet interconnect solutions that
we can potentially use across product lines," said Kim Jin-Gyeong, SVP and Head of SoC R&D
Center of LG. "The company's BlueLynx die-to-die interconnect IP
allows us to combine chiplets in varying process technologies,
facilitating more cost-effective scaling and greater IP reuse."
"We are excited to be working with LG, one of the largest TV
manufacturers and a leader in home appliance, air solutions, and
home entertainment," said Elad Alon,
CEO at Blue Cheetah. "Successful silicon bring-up of a complex SiP
is an essential first step. We look forward to a productive
alliance creating innovative chiplet solutions with LG."
Blue Cheetah's BlueLynx D2D interconnect subsystem IP provides
customizable physical (PHY) and link layer chiplet interfaces and
can support the Universal Chiplet Interconnect Express (UCIe) and
Open Compute Project (OCP) Bunch of Wires (BoW) standards.
About Blue Cheetah Analog Design
Blue Cheetah provides rapidly customizable standards-based
die-to-die interconnect solutions for chiplets. Its
state-of-the-art semiconductor IP solutions are process-adaptable
and customizable to achieve industry-leading power, performance,
and area for high-performance computing, AI/ML, networking, mobile,
and many other applications. The company's BlueLynx platform
provides chip makers the fastest, lowest-risk path to
application-optimized chiplet interconnect solutions. Blue Cheetah
was founded in 2018 and is headquartered in Sunnyvale, California. Visit
https://www.bcanalog.com/.
Media Contact:
Blue Cheetah Analog Design
Pauline Shulman
415-375-0303
382623@email4pr.com
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SOURCE Blue Cheetah Analog Design