SAN JOSE, Calif.,
Sept. 14,
2024 /PRNewswire/ -- From September 10-12, 2024, MSquare Technology made a
standout appearance at the highly anticipated AI Hardware &
Edge AI Summit in San Jose. With 1,500+ attendees and 75+ stellar
speakers from the industry leaders, the summit provided MSquare, a
leading provider of semiconductor IP and Chiplet solutions, a key
platform to showcase its latest products, highlighted its role in
driving innovation within the AI ecosystem through practical case
studies and proven results.
Pushing the Boundaries: Innovation-Driven and Shaping the
Future
At the forefront of innovation in interconnect IP and Chiplet
solutions, MSquare continues to break new ground. MSquare's IO Die
ML100, is a leading high-bandwidth memory solution. With its
integrated high-efficiency Die-to-Die interconnect IP and support
for the UCIe 1.1 protocol, the IO Die ML100 enables ultra-fast data
transfer and low-latency inter-chip communication, drastically
enhancing the efficiency of AI model training and inference,
propelling advancements in AI development.
The IO Die ML100, with its high-speed HBM3 memory subsystem,
offers a maximum bandwidth of 819.2 GB/s and supports a transfer
rate of 6400 Mbps, adhering to the standard HBM3 JESD238 protocol.
It meets the stringent demands for high bandwidth and low power
consumption in AI applications, laying a solid foundation for
future advancements in AI technology.
Diverse Product Portfolio: Setting the Standard for
Innovation
MSquare has built a comprehensive and robust IP product
portfolio, cementing its role as a key player in the development of
cutting-edge IP infrastructure. Its extensive range of IP products
has been validated and mass-produced across a wide spectrum of
process nodes, from 5nm to 180nm, supporting over 400 different
process technologies at the world's 5 leading foundries.
MSquare's portfolio includes high-speed interconnect IPs such as
HBM, LPDDR, ONFI, UCIe, eDP, PCIe, and USB, as well as advanced
Chiplet solutions like the M2LINK platform. Together, these
offerings form a powerful and open ecosystem that supports digital
transformation and drives innovation across industries, from AI and
data centers to automotive, IoT, and consumer electronics.
Global Expansion: Building an Ecosystem of Innovation
MSquare is accelerating its global expansion, establishing
strategic hubs in San Jose, Sydney, and Tokyo to foster deeper collaboration and
strengthen its position in the global AI and semiconductor
ecosystems. The AI Hardware & Edge AI Summit offered MSquare an
invaluable opportunity to not only demonstrate its technological
prowess but also foster collaboration with industry leaders across
the AI hardware landscape. MSquare is committed to working
alongside global partners to tackle the opportunities and
challenges of the AI era, shaping the future of the industry
together.
Looking Ahead: A New Era of AI Innovation
As AI and edge computing technologies continue to evolve at
breakneck speed, MSquare remains steadfast in its mission to lead
the charge in interconnect IP and Chiplet innovation. Through its
participation in this summit, MSquare has showcased its unwavering
commitment to pushing technological boundaries and driving the
future of AI. MSquare looks forward to continuing its collaboration
with industry peers to explore new possibilities and to create the
next era of AI advancements.
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SOURCE MSquare Technology
