Tackling the barriers to 3D-IC design
architecture
ROME, Nov. 19,
2024 /PRNewswire/ -- MZ Technologies has unveiled an
updated technology roadmap for its GENIOTM branded
integrated chiplet/packaging Co-Design EDA tool.
The roadmap calls for major
improvements throughout 2025, starting with four major additions to
a new GENIO's product that will be unveiled in the mid-January
timeframe. Other new features will be added around mid-year
and at year's end.
The new features to be
announced at the first of the year address some of most vexing
advanced systems challenges. The latest vision calls for tackling
thermal and mechanical issues. and will be accompanied by an
improved and modernized user interface. Mid-year, MZ is
expected to add additional thermal and interconnect features.
Thermal and Mechanical Stress Barriers
The new thermal and
mechanical features respond to thorny considerations in
next-generation 3D-ICs. In 3D-packaged heterogeneous
semiconductor devices, thermal stress arises from uneven heat
distribution during operation, potentially leading to warping and
reliability failures. Effective thermal management strategies are
essential to minimize temperature differentials, ensuring optimal
performance and longevity of the integrated chiplets within the
package.
Mechanical stress in
3D-packaged designs can result from factors such as thermal
expansion mismatch and substrate flexing. These stresses can cause
interconnect failures or delamination. A robust design framework
must address these challenges to maintain structural integrity and
performance across varying operational conditions and material
interfaces.
First Available Integrated Co-Design Tool
GENIO's proprietary, fully
integrated EDA co-design tool features an end-to-end IC and
packaging platform for 2D/2.5D/3D system design. It
integrates existing silicon and package EDA flows to create
full co-design and optimization of complex multi-chip designs that
comprise advanced heterogeneous microelectronic systems.
"MZ Technologies rolled out
the first commercially available co-design tool three years ago and
we feel an obligation to the EDA community to continue to
innovate.," said Anna Fontanelli,
Founder and CEO of MZ Technologies.
GENIO's cross-hierarchical,
3D-aware, design methodologies streamline the entire IC
eco-system. It integrates IC and advanced packaging design to
ensure full system level optimization, shorten the design cycle,
drive faster time-to-manufacturing and improve yields.
For a more information, go to
www.monozukuri.eu
About MZ Technologies
MZ Technologies is the marketing function of Monozukuri
S.p.A. Monozukuri's mission is to conquer 2.5D
& 3D design challenges for next generation electronic products
by delivering innovative, ground-breaking EDA software solutions
and methodologies. The technology redefines the co-design of
heterogeneous microelectronic systems by providing an improved
level of automation in three-dimensional interconnect
optimization.
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SOURCE Monozukuri Technologies