UNITED
STATES
SECURITIES
AND EXCHANGE COMMISSION
Washington,
D.C. 20549
FORM
6-K
REPORT
OF FOREIGN PRIVATE ISSUER
PURSUANT
TO RULE 13a-16 OR 15d-16
OF
THE SECURITIES EXCHANGE ACT OF 1934
For
the month of August 2023
Commission
File Number: 001-40368
SAI.TECH
Global Corporation
(Exact
name of registrant as specified in its charter)
#01-05
Pearl’s Hill Terrace, Singapore, 168976
(Address
of principal executive office)
Indicate
by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.
Form
20-F ☒ Form 40-F ☐
Press
Release
On August 7, 2023, SAI.TECH Global Corporation (the “Company”)
issued a press release announcing the return of the Company’s “2nd Bit Heat Day” event at its newly powered up U.S.
R&D Center SAI NODE Marietta in Ohio.
A
copy of the press release is furnished as Exhibit 99.1 to this current report on Form 6-K and incorporated by reference herein.
SIGNATURES
Pursuant
to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by
the undersigned, thereto duly authorized.
Date: August 15, 2023 |
SAI.TECH GLOBAL CORPORATION |
|
|
|
|
By: |
/s/ Risheng
Li |
|
Name: |
Risheng Li |
|
Title: |
Chief Executive Officer |
3
Exhibit 99.1
SAI.TECH
Announces to host the upcoming “2nd Bit Heat Day” at its newly powered up U.S. R&D Center SAI NODE Marietta in Ohio
Singapore,
Aug. 07, 2023 (GLOBAL NEWSWIRE) — SAI.TECH Global Corporation (“SAI.TECH” or “SAI” or the “Company”,
NASDAQ: SAI, SAITW) is proud to announce the return of its 2nd “Bit Heat Day,” which will take place on August 9, 2023, in
Marietta, Ohio. The second Bit Heat Day will be held at the newly built SAI US R&D Center SAI NODE Marietta and the OCEC Computing
Heat Recycle Technology Development Center (together, the “Centers”), which is successfully powered on today after months
of development.
About
Bit Heat Day
The
2nd, 2023 Bit Heat Day is hosted by SAI and the Organization of Clean Energy and Climate (“OCEC”), a non-profit organization.
On the event, SAI and OCEC will unveil the groundbreaking SAI US R&D Center SAI NODE Marietta and OCEC Computing Heat Recycle Technology
Development Center located in Marietta, Ohio. The guests will be the first to witness how SAI’s proprietary technology captures
waste heat from high-performance computing and supply the recycled heat for greenhouse heating in a controlled manner. The recycled heat
can be used not only to benefit agricultural operations, but also have the potential to expand to residential and commercial heating
applications, or fishery and poultry applications in the future.
The
SAI US R&D Center and OCEC Computing Heat Recycle Center will serve as an open scale-up testing platform for computing heat capture
and supply technology, data center operation system and various heat recycle applications supported by current and future AI and Bitcoin
mining technology.
“On
last year’s 1st Heat Day, we used SAI’s liquid cooling waste heat recovery technology to bring Satoshi Nakamoto’s prediction
into reality. In 2010, Satoshi said that Bitcoin mining would ultimately be used for heating. On the 2nd Bit Heat Day event, when the
timing coincides with the growing demand for AI computing, we hope to use SAI’s solution to quickly transition the computing power
of BTC and AI to a clean and sustainable state.” The founder and CEO of SAI, Arthur Lee, expresses his excitement about this upcoming
event. “We also hope that more chip, computing power, and cloud computing service companies will join us to accelerate this process.”
Arthur
believes that in 10 years, at least 30% of the global BTC and AI computing power should have the capability to utilize waste heat. Only
in this way can the globe accelerate the realization of carbon neutrality. He adds, “our mission is to let every individual in
the future benefit from sustainable and cost-effective BTC & AI computing services.”
This
initiative underscores SAI’s dedication to empowering the intensive computing industry with sustainability and social responsibility.
Below
are some important details about this event:
The
event will take place from 2:00 to 4:00 p.m. Wednesday, August 9 at 550 Gravel Bank Road, Marietta, OH, 45750.
Event
Agenda:
2:00-
3:00 p.m. Welcome remark & Keynote speech
Jesse
C. Roush – Executive Director of Southeast Ohio Port Authority. His topic is how a merger of historic competencies and high-performance
computing in local areas (industrial electricity and agriculture) can support economic growth.
Tao
Wu – OCEC Director of Computing Heat Recycle Technology Development Center. His topic is the challenges and Future of Computing
Heat Recycling.
Marcus
McCartney – Agriculture and Natural Resources Educator of Ohio State University. His topic is how agriculture could benefit
from computing heat recycling.
Lauren
Lin – Director of Business Development of Luxor. His topic is the Hashrate Index: Shining a Light on Bitcoin Mining’s
Energy Consumption.
Haotian
Li – CTO of Redesign Science. His topic is utilizing computation to find a cure for cancer.
Arthur
Lee – CEO of SAI. His topic is the future of the Heat Recycle Center.
3:00-
4:00 p.m. The greenhouse and data center tour
SAI
will guide you through the local greenhouse to witness plants thriving under the heat supply.
After
4:00 p.m. Tea break & guest networking
Guests
will have time to socialize over catering services.
For
more information on 2023 Bit Heat Day, please follow the Bit Heat Day featured Twitter account: @Bitcoinheatday and SAI’s official
twitter account: @SAI2TECH. Please note that the event will also be live on YouTube.
SAI
is pleased to explore the future of advanced technologies in liquid cooling and computing heat recovery with the welcoming guests.
About
SAI.TECH
SAI.TECH
is a Nasdaq-listed (SAI) company headquartered in Singapore. SAI is dedicated to providing a zero-carbon energy system (HEATNUC) based
on Small Modular Reactor, providing clean computing services based on liquid cooling and chip waste heat utilization technology (ULTIWIT),
and providing cloud computing services based on blockchain and AI technology (BOLTBIT).
In
May 2022, SAI became a publicly traded company under the new ticker symbol “SAI” on the Nasdaq Stock Market (NASDAQ) through
a merger with TradeUP Global Corporation (“TradeUP”). For more information on SAI.TECH, please visit https://sai.tech/.
About
OCEC
The
Organization of Clean Energy and Climate (“OCEC”) is a non-profit organization with the mission to perform research and study
on more effective ways to use computing heat, develop the technology and system to demonstrate how residential, commercial, and industrial
scenarios can recycle the computing heat waste as a replacement for traditional heating.
The
OCEC operates with the goal of building the OCEC Computing Heat Recycle Technology Development Center in a way to benefit the local community.
As the first of this kind of R&D center, OCEC continues to be the leader in this area and brings the best computing heat recycling
solution to the world, and be one of the key contributors to achieving carbon-neutral efforts.
For
more information on OCEC, please visit https://ocec.co/.
Safe
Harbor Statement:
This
press release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. The
words “believe”, “expect”, “anticipate”, “project”, “targets”, “optimistic”,
“confident that”, “continue to”, “predict”, “intend”, “aim”, “will”
or similar expressions are intended to identify forward-looking statements. All statements other than statements of historical fact are
statements that may be deemed forward-looking statements. These forward-looking statements including, but not limited to, statements
concerning SAI.TECH and the Company’s operations, financial performance and condition are based on current expectations, beliefs
and assumptions which are subject to change at any time. SAI.TECH cautions that these statements by their nature involve risks and uncertainties,
and actual results may differ materially depending on a variety of important factors such as government and stock exchange regulations,
competition, political, economic and social conditions around the world including those discussed in SAI.TECH’s Form 20-F under
the headings “Risk Factors”, “Results of Operations” and “Business Overview” and other reports filed
with the Securities and Exchange Commission from time to time. All forward-looking statements are applicable only as of the date it is
made and SAI.TECH specifically disclaims any obligation to maintain or update the forward-looking information, whether of the nature
contained in this release or otherwise, in the future.
Media
Contact
marketing@sai.tech
Investor
Relations Contact
ir@sai.tech
3
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